M1A3PE3000-2FGG896

The M1A3PE3000-2FGG896 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 896-ball BGA package. It provides a high-density, commercial-grade programmable logic solution combining large logic capacity, significant embedded memory, and a high I/O count in a surface-mount package.

Designed for commercial applications, the device is characterized by a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Capacity  Approximately 3,000,000 gates and 75,264 logic elements provide substantial programmable logic resources for complex digital functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and other memory-intensive logic tasks.
• I/O Density  620 available I/Os to support multiple interfaces, parallel buses, and high-pin-count connectivity requirements.
• Package  896-FBGA (31×31) package case, supplied as a surface-mount device for compact board-level integration.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial embedded systems  High logic density and abundant I/Os enable implementation of custom controllers and digital subsystems for commercial products.
• Board-level designs with dense I/O  620 I/Os support complex interfacing and protocol connections in compact board designs using the 896-BGA surface-mount package.
• Logic- and memory-intensive functions  The combination of 75,264 logic elements and approximately 0.516 Mbits of embedded memory supports designs that require substantial on-chip resources.
• Compact high-density applications  The 896-FBGA (31×31) package enables integration of significant FPGA capability in space-constrained commercial products.

Unique Advantages

• High logic density: 75,264 logic elements and 3,000,000 gates allow integration of complex digital functions on a single device, reducing external component count.
• Substantial on-chip memory: Approximately 0.516 Mbits of embedded RAM supports buffering, FIFOs, and local state storage without added external memory.
• Extensive I/O capability: 620 I/Os provide flexibility for multi-interface designs, parallel buses, and high-pin-count systems.
• Compact surface-mount package: 896-FBGA (31×31) packaging enables high-density board-level integration while keeping a small PCB footprint.
• Commercial-grade operation: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial product environments.

Why Choose M1A3PE3000-2FGG896?

The M1A3PE3000-2FGG896 delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 896-BGA surface-mount package, making it well suited for commercial designs that require significant on-chip resources and dense connectivity. As part of the ProASIC3E family from Microchip Technology, the device provides a verified option for developers seeking a programmable solution with clear supply and thermal specifications.

This device is ideal for designers and teams building commercial embedded systems, board-level products with high I/O requirements, or any application that benefits from integrating large programmable logic and memory resources into a compact surface-mount package.

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