M1A3PE3000-2FGG896I

The M1A3PE3000-2FGG896I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It provides a substantial programmable fabric with 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and up to 620 general-purpose I/O for dense, system-level integration.

Built and specified for industrial use, this surface-mount device is delivered in an 896-ball fine-pitch BGA (31 × 31) package and supports a device supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 75,264 logic elements provide significant capacity for complex custom logic, control functions, and hardware acceleration.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density Up to 620 I/O pins support extensive parallel interfacing to peripherals, sensors, and external devices.
• Package & Mounting 896-ball fine-pitch BGA (896-FBGA, 31 × 31) designed for surface-mount assembly where high pin-count and compact footprint are required.
• Power Single device supply specified between 1.425 V and 1.575 V for predictable power integration and system planning.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial and harsh-environment applications.
• RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
• Device Complexity Approximately 3,000,000 gates enabling implementation of sizeable custom logic functions and system-level integration.

Typical Applications

• Industrial Control: Use the device’s industrial temperature rating and high I/O count for motor control, PLC interfaces, and factory automation I/O aggregation.
• Embedded Systems: Implement custom processing blocks, hardware accelerators, and glue logic where substantial logic resources and embedded RAM are required.
• Data Acquisition and Signal Conditioning: Leverage abundant I/O and on-chip memory for buffering sensor data, implementing digital filters, and preprocessing streams.
• Communications and Networking Equipment: Deploy the FPGA for protocol handling, data steering, and custom packet processing with high pin-count connectivity.

Unique Advantages

• Significant Logic Capacity: 75,264 logic elements accommodate complex designs and multiple concurrent functions within a single device.
• High I/O Count: 620 I/O pins reduce the need for external multiplexing and simplify board-level connectivity for dense systems.
• Compact, High-Pin Package: 896-FBGA (31 × 31) provides maximum connectivity in a compact form factor for space-constrained designs.
• Industrial Reliability: Rated from −40 °C to 100 °C and classified as industrial grade to support demanding operational environments.
• Predictable Power Integration: Narrow supply window (1.425 V–1.575 V) simplifies power rail design and regulation choices.
• Regulatory Compliance: RoHS compliance facilitates integration into lead-free manufacturing flows.

Why Choose M1A3PE3000-2FGG896I?

The M1A3PE3000-2FGG896I positions itself as a high-capacity, industrial-grade FPGA suited to systems that require substantial programmable logic, abundant I/O, and on-chip memory within a compact BGA footprint. Its specification set supports robust, long-life deployments where thermal range and reliable connectivity matter.

This device is well suited for designers and engineers building industrial control systems, embedded processing platforms, and communications equipment who need a scalable, integrated logic solution backed by a known manufacturer.

Request a quote or submit an inquiry to receive pricing and availability information for M1A3PE3000-2FGG896I and to discuss suitability for your next design.