M1A3PE3000-2PQG208I

The M1A3PE3000-2PQG208I is a ProASIC3E FPGA by Microchip Technology designed for embedded digital logic implementation. The device provides 3,000,000 gates, approximately 75,264 logic elements, and roughly 0.52 Mbits of on-chip embedded memory, enabling a wide range of user-defined logic functions and data buffering within a single surface-mount package.

With 147 I/Os, a 208-BFQFP footprint, an industrial operating temperature range, and a precise core supply window, this FPGA is positioned for industrial-grade applications that require stable logic resources, deterministic I/O count, and on-chip RAM capacity.

Key Features

• Logic Capacity — Provides 75,264 logic elements (LEs) and 3,000,000 gates for implementing complex custom logic and state machines.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM for buffering, FIFOs, and small data storage needs within the FPGA fabric.
• I/O Resources — 147 user I/Os to support multiple peripheral interfaces and board-level connectivity requirements.
• Package & Mounting — 208-BFQFP supplier device package (208-PQFP, 28 × 28) in a surface-mount form factor for standard PCB assembly.
• Power Supply — Core voltage supply range of 1.425 V to 1.575 V to meet specified device operating conditions.
• Temperature & Grade — Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial control systems — Use the device’s industrial temperature range, abundant logic elements, and I/O count to implement custom control logic and deterministic I/O handling.
• Embedded processing peripherals — Leverage on-chip RAM and logic resources to implement interface bridges, custom peripherals, and protocol handling close to the hardware.
• Prototype and custom hardware — Deploy as a programmable fabric for validating hardware functions or replacing multiple discrete logic components in surface-mount designs.

Unique Advantages

• Substantial logic density: 75,264 logic elements and 3,000,000 gates provide room for sizable custom logic implementations within a single device.
• Integrated memory: Approximately 0.52 Mbits of embedded RAM reduces the need for external buffering components and simplifies board-level memory design.
• Ample I/O count: 147 I/Os enable integration with multiple peripherals and sensors without immediate need for external I/O expanders.
• Industrial temperature capability: Rated −40 °C to 100 °C for deployments where extended temperature performance is required.
• Standard surface-mount packaging: 208-BFQFP (208-PQFP, 28 × 28) supports common PCB assembly workflows and mechanical layouts.
• Regulatory readiness: RoHS compliance supports environmentally regulated production requirements.

Why Choose M1A3PE3000-2PQG208I?

The M1A3PE3000-2PQG208I combines a large logic fabric, integrated memory, and a substantial I/O count in a standard surface-mount 208-BFQFP package. Its industrial operating range and tightly specified core voltage make it suitable for designs that require stable, long-term operation in temperature-challenging settings.

This device is well suited to engineers and procurement teams seeking a programmable, highly integrated FPGA solution for industrial and embedded projects where on-chip logic density, embedded RAM, and deterministic I/O count can reduce BOM complexity and simplify board-level design choices.

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