M1A3PE3000-FG484I

IC FPGA 341 I/O 484FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

Quantity 207 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O341Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000-FG484I – ProASIC3E Field Programmable Gate Array (FPGA) IC, 484-BGA

The M1A3PE3000-FG484I is a ProASIC3E family FPGA provided in a 484-BGA package. It combines a high count of logic elements and on-chip RAM with a broad I/O complement and industrial-grade operating range for demanding embedded designs.

Key Features

  • Logic Capacity  Approximately 75,264 logic elements (reported as 75,264), enabling complex programmable logic implementations within a single device.
  • Gate Equivalence  Rated at 3,000,000 gates, providing a numerical reference for integration density.
  • Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, lookup tables, and state storage.
  • I/O Resources  341 user I/O pins to support broad peripheral and system interfacing requirements.
  • Power Supply  Specified nominal voltage range of 1.425 V to 1.575 V for core operation.
  • Package and Mounting  484-ball FPBGA (23 × 23) package, surface-mount mounting type, ideal for compact board layouts.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet elevated environmental requirements.
  • RoHS Compliant  Manufactured to meet RoHS environmental standards.

Unique Advantages

  • Substantial Logic Density: The device's ~75k logic elements and 3M gate equivalence enable consolidation of complex functions into a single FPGA, reducing external component count.
  • Integrated On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports local data buffering, state machines, and small LUT-based memories without added external memory.
  • High I/O Count: 341 I/O pins provide flexibility for interfacing multiple peripherals, bus connections, and signal domains on a single device.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for applications requiring extended temperature capability.
  • Compact Board Footprint: The 484-FPBGA (23×23) package delivers high integration in a surface-mount form factor for space-constrained PCBs.
  • Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose M1A3PE3000-FG484I?

The M1A3PE3000-FG484I positions itself as a robust FPGA option where substantial logic resources, on-chip RAM, and a large I/O count are required within an industrial temperature envelope. Its combination of ~75k logic elements, approximately 0.52 Mbits of embedded memory, and 341 I/Os makes it suitable for designs that demand integration and stable operation across a wide temperature range.

For engineers and procurement teams targeting compact, surface-mount implementations, the 484-FPBGA (23×23) package balances high integration density with board-level manufacturability. Choose this device when your design priorities include logic capacity, extensive I/O, and industrial-grade operating conditions.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3PE3000-FG484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up