M1A3PE3000-FG324I

The M1A3PE3000-FG324I is a ProASIC3E family Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density, industrial-grade programmable logic element with a surface-mount 324-BGA package (324-FBGA, 19×19) for compact system integration.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 221 user I/Os and roughly 3,000,000 gates, this device targets designs that require significant on-chip logic and I/O capacity while operating over an industrial temperature range and a defined core supply voltage.

Key Features

• Core Logic 
  75,264 logic elements (logic element cells) and approximately 3,000,000 gates provide substantial capacity for complex, custom digital functions.
• Embedded Memory 
  Approximately 0.516 Mbits of on-chip RAM for local buffering, state storage and block-memory requirements.
• I/O Density 
  221 user I/O pins enable dense external connectivity for peripherals, sensors and buses.
• Power 
  Defined voltage supply range of 1.425 V to 1.575 V for core operation.
• Package & Mounting 
  324-BGA (324-FBGA, 19×19) surface-mount package for compact PCB footprint and high pin density.
• Environmental & Grade 
  Industrial-grade device rated for operation from -40 °C to 100 °C and RoHS compliant.

Typical Applications

• Industrial Control 
  Programmable logic and wide operating temperature range make this device suitable for control and automation systems that require substantial on-chip logic and many I/Os.
• Communications & Networking 
  High I/O count and large gate count support protocol processing, data routing and interface aggregation in communications equipment.
• Embedded Systems 
  Used where compact packaging and significant logic plus embedded memory are needed to implement custom accelerators, glue logic and peripheral integration.

Unique Advantages

• High Logic Capacity: 75,264 logic elements enable integration of large or multiple logic functions on a single device, reducing external component count.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Extensive I/O: 221 user I/Os provide flexibility for interfacing to a wide range of peripherals and system-level signals.
• Industrial-Grade Operation: Rated from -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact, High-Density Package: 324-FBGA (19×19) surface-mount package balances PCB space savings with high pin count.
• Regulatory Compliance: RoHS compliant for environmentally conscious designs.

Why Choose M1A3PE3000-FG324I?

The M1A3PE3000-FG324I combines substantial logic density, embedded memory and a high I/O count in a compact 324-BGA package, positioned for applications that require on-board programmable logic with industrial temperature capability. Its specified core voltage range and RoHS compliance provide clear electrical and environmental parameters for system design.

This device is suited to design teams needing to consolidate discrete logic, implement complex state machines or aggregate multiple interfaces while maintaining a small PCB footprint and meeting industrial temperature requirements. The combination of logic capacity, memory and I/O count offers a scalable platform for mid- to high-density programmable logic solutions.

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