M1A3PE3000-FG896

The M1A3PE3000-FG896 is a ProASIC3E field programmable gate array (FPGA) IC designed to provide substantial logic capacity and I/O density in a compact BGA package. With 3,000,000 gates and 75,264 logic elements, this device suits board-level designs that require high logic integration and extensive external connectivity.

Its combination of embedded memory, a wide I/O count and a defined supply-voltage window supports designers seeking a balanced solution for complex digital implementations within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 75,264 logic elements and 3,000,000 gates for implementing substantial custom digital logic.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for data buffering and state storage.
• I/O Density  620 user I/O pins to support extensive peripheral and interface connectivity on the board.
• Power  Specified operating supply voltage range of 1.425 V to 1.575 V to match system power requirements within that window.
• Package & Mounting  896-ball FBGA package (896-FBGA, 31×31) in a surface-mount form factor for compact, high-density board layouts.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard electronic applications.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital systems  Use the large logic capacity and on-chip RAM to consolidate system functions and implement complex digital architectures.
• Multi-interface boards  The 620 I/Os enable dense peripheral interfacing and flexible signal routing for board-level integration.
• System integration and glue logic  Replace multiple discrete components by implementing control and glue logic directly in the FPGA fabric.

Unique Advantages

• High logic integration: 75,264 logic elements and 3,000,000 gates allow large or multiple functions to be combined in a single device, simplifying board design.
• Substantial I/O support: 620 I/O pins provide flexibility to interface with many peripherals and buses without external expanders.
• On-chip memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state retention, reducing external memory dependency.
• Compact package: The 896-FBGA (31×31) surface-mount package delivers high pin count in a compact footprint for space-constrained PCBs.
• Commercial temperature suitability: Rated 0 °C to 85 °C to meet the needs of standard temperature-range electronic designs.
• RoHS compliance: Conforms to lead-free requirements for modern assembly processes and regulatory needs.

Why Choose M1A3PE3000-FG896?

The M1A3PE3000-FG896 is positioned for designers who need substantial logic density, large I/O counts and on-chip memory in a compact BGA footprint. Its defined supply-voltage range, commercial operating temperature and RoHS compliance make it suitable for a wide range of standard electronic designs that demand integration and board-level consolidation.

Choose this FPGA when you require a solution that balances logic capacity, connectivity and packaging for scalable, robust system designs while adhering to commercial-grade operating conditions.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000-FG896. Our team will respond with the details you need to move your design forward.