M1A3PE3000-FGG324

The M1A3PE3000-FGG324 is a ProASIC3E field programmable gate array (FPGA) in a 324-ball BGA package. It provides a substantial logic fabric with 75,264 logic elements and approximately 0.5 Mbits of embedded memory, along with 221 general-purpose I/O pins for highly integrated designs.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.425 V to 1.575 V supply and across an operating temperature range of 0 °C to 85 °C, offering a compact solution for systems that require mid-to-high density programmable logic and on-chip memory in a 19 × 19 324-FBGA footprint.

Key Features

• Logic Capacity — 75,264 logic elements (LEs) providing a programmable fabric suitable for complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 0.5 Mbits of on-chip RAM (516,096 total RAM bits) for data buffering, FIFOs, and small embedded storage needs.
• Gate Count — Approximately 3,000,000 gates to support sizeable digital designs and system integration.
• I/O — 221 user I/O pins to interface with peripherals, buses, and external devices without requiring external I/O expanders.
• Power — Core supply voltage range of 1.425 V to 1.575 V for stable operation within specified supply margins.
• Package & Mounting — 324-BGA (supplier package: 324-FBGA 19×19) in a surface-mount format to minimize board footprint while maximizing pin count.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C for a wide range of commercial applications.
• Compliance — RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.

Unique Advantages

• High logic density: 75,264 logic elements enable consolidation of complex functions on a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 0.5 Mbits of embedded RAM supports data buffering and local storage without external memory.
• Generous I/O count: 221 I/O pins provide flexibility for connecting multiple peripherals, interfaces, and buses directly to the FPGA.
• Compact package: 324-FBGA (19×19) delivers high pin density in a compact surface-mount footprint, aiding space-constrained PCB layouts.
• Commercial temperature range: Specified for 0 °C to 85 °C, suitable for standard commercial applications and environments.
• Regulatory compliance: RoHS compliant to support lead-free manufacturing and compliance objectives.

Why Choose M1A3PE3000-FGG324?

The M1A3PE3000-FGG324 combines mid-to-high density programmable logic, on-chip memory, and a high I/O count in a compact 324-BGA package, making it a practical choice for commercial applications that require integration and board-space efficiency. Its core supply range and defined operating temperature provide clear electrical and environmental parameters for system design.

This FPGA is suited to designers seeking a single-device solution that balances logic capacity (75,264 logic elements and ~3 million gates), embedded memory (approximately 0.5 Mbits), and flexible I/O in a surface-mount 19 × 19 324-FBGA footprint, while maintaining RoHS compliance for lead-free assembly.

Request a quote or submit an inquiry to obtain pricing, availability, and support for integration of the M1A3PE3000-FGG324 into your next design.