M1A3PE3000-FGG896

The M1A3PE3000-FGG896 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides extensive programmable logic with 75,264 logic elements and approximately 0.516 Mbits of embedded memory to support complex, reconfigurable designs.

Built for commercial-grade applications, this device delivers up to 3,000,000 gates, 620 user I/O pins, and a compact 896-BGA (896-FBGA, 31×31) package. It operates from a 1.425 V to 1.575 V supply and across a 0 °C to 85 °C temperature range, with surface-mount packaging and RoHS compliance.

Key Features

• Core Logic  75,264 logic elements providing substantial capacity for combinational and sequential logic implementation.
• Gate Count  Approximately 3,000,000 gates for complex system integration and implementation of sizable logic functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and small data tables.
• I/O Density  620 available I/O pins to accommodate high-pin-count interfaces and multiple external connections.
• Power  Operates from a defined supply range of 1.425 V to 1.575 V for predictable power planning and supply design.
• Package and Mounting  896-BGA package (supplier device package: 896-FBGA, 31×31) with surface-mount mounting for compact board integration.
• Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Unique Advantages

• High logic capacity: 75,264 logic elements enable implementation of large, multi-function designs without immediate migration.
• Substantial gate count: ~3,000,000 gates allow dense logic mapping and complex algorithm acceleration on-chip.
• Generous I/O availability: 620 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and external memories.
• On-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for control and data buffering.
• Compact, industry-standard package: 896-BGA (896-FBGA, 31×31) supports high pin-count designs while minimizing board footprint.
• Commercial operating range: 0 °C to 85 °C supports a wide range of non-industrial applications and deployments.

Why Choose M1A3PE3000-FGG896?

The M1A3PE3000-FGG896 positions itself as a high-capacity, commercially rated FPGA solution from Microchip Technology, combining tens of thousands of logic elements, significant gate density, and substantial I/O capability in a single 896-BGA package. It is well suited to designers who need reconfigurable logic, on-chip memory, and high I/O density within a commercial temperature envelope.

Choose this device when your design requires a balance of programmable logic resources, embedded memory, and compact packaging, backed by RoHS compliance and defined electrical and thermal operating ranges.

Request a quote or submit a parts inquiry to receive pricing and availability for the M1A3PE3000-FGG896.