M1A3PE3000-PQG208

The M1A3PE3000-PQG208 is a ProASIC3E family Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic resource set in a 208-BFQFP surface-mount package. It provides 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 147 user I/Os, making it suitable where substantial on-chip logic, memory and I/O count are required in a commercial-temperature device.

Key Features

• Core Logic 75,264 logic elements (LEs) and 3,000,000 equivalent gates provide a large programmable fabric for complex digital designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state machines and local data storage without external memory.
• I/O Count 147 general-purpose I/Os to enable broad peripheral and interface connectivity directly from the device.
• Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for board-level integration.
• Power Supported core voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Embedded digital processing Implement custom logic, data paths and control functions using the device’s high logic element count and embedded RAM.
• I/O aggregation and protocol bridging Use the 147 I/Os to consolidate peripheral interfaces and perform protocol conversion or glue-logic duties on-board.
• Prototyping and system integration Integrate complex designs in a surface-mount 208-BFQFP package for evaluation and integration into commercial-temperature systems.

Unique Advantages

• High on-chip logic density: 75,264 logic elements enable implementation of sizable digital systems without immediate reliance on external ASICs or additional FPGAs.
• Integrated embedded memory: Approximately 0.516 Mbits of RAM supports local buffering and fast data handling, reducing external memory needs.
• Substantial I/O availability: 147 user I/Os allow direct connection to multiple peripherals and interfaces, simplifying board-level design.
• Standard surface-mount packaging: 208-BFQFP (28×28) package facilitates compatibility with established PCB assembly workflows and form-factor requirements.
• Commercial temperature and RoHS compliance: Commercial-grade rating (0 °C to 85 °C) and RoHS compliance support mainstream product designs and regulatory requirements.
• Defined core voltage range: A clear supply window of 1.425 V to 1.575 V helps align power-supply planning and system integration.

Why Choose M1A3PE3000-PQG208?

The M1A3PE3000-PQG208 positions itself as a high-density, commercially graded FPGA option for designers who need a large count of logic elements, substantial embedded RAM and abundant I/O in a 208-BFQFP surface-mount package. Its defined voltage range, temperature rating and RoHS compliance make it a practical choice for mainstream electronic products and development platforms.

Choose this device when your design requires integrated logic capacity, on-chip memory and flexible I/O provisioning within a standard package footprint—enabling consolidation of functions and streamlined board design.

Request a quote or submit a pricing inquiry for the M1A3PE3000-PQG208 to receive availability and lead-time information tailored to your project needs.