M1A3PE3000-PQ208I

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

Quantity 844 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000-PQ208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

The M1A3PE3000-PQ208I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It provides a substantial logic resource set and on-chip memory to implement complex programmable functions while operating across an extended industrial temperature range.

This surface-mount device integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory, along with 147 user I/Os and a 3,000,000-gate equivalent capacity, making it suitable for designs that require dense logic integration, flexible I/O, and reliable operation in demanding environments.

Key Features

  • Logic Capacity  75,264 logic elements (cells) to implement complex custom logic and state machines.
  • Gate Equivalent  3,000,000 gates of logic capacity for substantial combinational and sequential logic integration.
  • Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Resources  147 general-purpose I/O pins to support wide interface requirements and parallel connectivity.
  • Power Supply  Targeted core supply range of 1.425 V to 1.575 V for defined power planning and system integration.
  • Package and Mounting  208-BFQFP package case with supplier device package 208-PQFP (28×28) in a surface-mount form factor for PCB assembly.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
  • Regulatory Compliance  RoHS compliant for lead-free process and environmental considerations.

Typical Applications

  • Industrial Control  Programmable logic and interface consolidation in control systems where industrial temperature operation and reliability are required.
  • Embedded Processing  Custom datapath and control logic implementations leveraging the 75,264 logic elements and on-chip RAM for local processing tasks.
  • I/O-Intensive Interfaces  Bridge and protocol conversion applications that need up to 147 I/O pins for parallel and peripheral connections.

Unique Advantages

  • High Logic Density: The 75,264 logic elements and 3,000,000-gate capacity let you implement large, integrated logic functions with fewer external components.
  • On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependency on external memory for buffering and local data handling.
  • Robust Industrial Operation: Rated operation from −40 °C to 100 °C supports deployment in industrial and temperature-demanding environments.
  • Generous I/O Count: 147 I/O pins provide flexibility for parallel interfaces, sensor connections, and multiple peripheral buses.
  • Standard Surface-Mount Package: 208-pin PQFP footprint (28×28) for straightforward PCB integration and automated assembly.
  • RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing and regulatory alignment.

Why Choose M1A3PE3000-PQ208I?

The M1A3PE3000-PQ208I positions itself as a high-capacity FPGA option for industrial designs that need substantial programmable logic, embedded memory, and a large I/O complement in a surface-mount PQFP package. Its specified voltage range and industrial operating temperature rating support reliable integration into systems with defined power rails and extended thermal requirements.

Backed by Microchip Technology, this device is suited for engineers and procurement teams designing industrial control, embedded processing, or I/O-rich applications that require clear, verifiable hardware capabilities and regulatory compliance for lead-free assembly.

Request a quote or contact sales to discuss pricing, availability, and how M1A3PE3000-PQ208I can fit your next design.

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