M1A3PE3000L-1FG484

The M1A3PE3000L-1FG484 is a commercial-grade ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology. It offers substantial programmable logic capacity and I/O density in a compact 484-ball FBGA package for commercial embedded designs.

Key on-chip resources include approximately 75,264 logic elements, roughly 0.516 Mbits of embedded memory, about 3,000,000 gates and 341 I/Os. The device is designed for surface-mount assembly and operates from a core supply range of 1.14 V to 1.575 V with an ambient temperature rating of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 75,264 logic elements (cells) supporting complex, high-density logic implementations and custom datapaths.
• Gate Count  Around 3,000,000 gates to accommodate broad combinational and sequential logic requirements.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs and small lookup tables.
• I/O Resources  341 user I/Os for wide external connectivity and signal interfacing.
• Power  Core supply voltage range from 1.14 V to 1.575 V to match low-voltage system rails.
• Package & Mounting  484-BGA in a 484-FPBGA (23×23) supplier package; surface-mount mounting type for compact board-level integration.
• Operating Range  Commercial temperature grade rated for 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial embedded systems  Custom logic, peripheral interfacing and board-level integration where high logic density and many I/Os are required.
• Communications equipment  Protocol handling, packet processing and interface bridging using the device's logic and I/O resources.
• Test and measurement  Custom signal conditioning, control logic and data path processing in bench and rack instruments.
• Prototyping and development  Platform for validating custom digital architectures and integrating multiple I/O functions on a single device.

Unique Advantages

• High logic density: The device’s approximately 75,264 logic elements enable implementation of complex, integrated logic functions that reduce external components.
• Substantial gate capacity: Around 3,000,000 gates provide headroom for wide datapaths and feature-rich designs.
• Generous I/O count: 341 I/Os simplify board routing and reduce the need for external multiplexers or expanders.
• On-chip memory: Approximately 0.516 Mbits of embedded RAM supports buffering and small local storage without external memory.
• Compact surface-mount BGA: 484-FPBGA (23×23) packaging delivers a small footprint for space-constrained PCBs while maintaining strong routing capability.
• Commercial temperature rating: Rated 0 °C to 85 °C for a wide range of commercial electronic products.

Why Choose M1A3PE3000L-1FG484?

The M1A3PE3000L-1FG484 positions itself as a commercially rated, high-density FPGA option for designers who need substantial logic, on-chip memory and a large number of I/Os in a compact surface-mount package. Its combination of roughly 75,264 logic elements, approximately 0.516 Mbits of embedded RAM and 341 I/Os makes it suitable for consolidating multiple functions into a single device, simplifying board design and reducing component count.

This device is appropriate for commercial embedded designs, communications equipment and test systems where a balance of logic capacity, I/O density and compact packaging is required. Choosing this FPGA supports scalable designs that leverage significant on-chip resources and RoHS-compliant assembly.

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