M1A3PE3000L-1FG896

The M1A3PE3000L-1FG896 is a ProASIC3L FPGA from Microchip Technology designed as a configurable digital logic device. It provides a substantial amount of on-chip logic and I/O capability for applications requiring programmable gate density and flexible interfacing.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 620 I/O pins in a 896-FBGA (31×31) surface-mount package, this commercial-grade device targets designs that need significant logic capacity and a high I/O count within a compact package footprint.

Key Features

• Core Logic  Contains 75,264 logic elements and 3,000,000 gates to implement complex user-defined digital functions.
• Embedded Memory  Provides approximately 0.52 Mbits of on-chip RAM for buffering, state storage and logic support.
• I/O Density  620 general-purpose I/O pins enable wide connectivity options for interfaces, peripherals and board-level routing.
• Power Supply  Operates from a supply range of 1.14 V to 1.575 V to match system power requirements within the specified range.
• Package & Mounting  Packaged in an 896-ball FBGA (31×31) surface-mount case for high-density board integration.
• Temperature & Grade  Commercial grade device rated for 0°C to 85°C ambient operation.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Logic and Prototyping  Implement user-defined digital circuits and complex state machines using the device's 75,264 logic elements and 3,000,000 gates.
• High-Density I/O Interfacing  Use the 620 I/O pins to connect multiple peripherals, sensors, or high-channel-count interfaces on a single board.
• Embedded Memory Functions  Leverage approximately 0.52 Mbits of on-chip RAM for buffering, data staging or small lookup tables within custom logic.

Unique Advantages

• High Logic Capacity: 75,264 logic elements and 3,000,000 gates enable implementation of substantial custom digital functionality within a single device.
• Extensive I/O Count: 620 I/O pins reduce the need for external expanders and simplify board-level connectivity.
• Compact, High-Density Package: The 896-FBGA (31×31) surface-mount package delivers a small footprint for integrating significant logic and I/O on space-constrained PCBs.
• Defined Power Envelope: Supported supply range of 1.14 V to 1.575 V provides clear electrical parameters for power design and sequencing.
• Commercial Temperature Rating: Rated for 0°C to 85°C operation to match common commercial applications and deployment environments.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing standards.

Why Choose M1A3PE3000L-1FG896?

The M1A3PE3000L-1FG896 positions itself as a high-capacity, high-I/O FPGA option from Microchip Technology suitable for designs that require substantial programmable logic and extensive board interfacing in a compact package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 620 I/O pins provides a balanced platform for implementing complex custom logic while managing board-level connectivity.

Engineers and procurement teams looking for a commercial-grade FPGA with clear electrical and thermal ratings can leverage this device for mid- to high-complexity digital designs, benefiting from the integration and packaging that simplify BOM and board layout decisions.

Request a quote or contact sales to discuss availability, lead times and pricing for the M1A3PE3000L-1FG896.