M1A3PE3000L-1FGG484

IC FPGA 341 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

Quantity 1,095 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O341Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000L-1FGG484 – ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

The M1A3PE3000L-1FGG484 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It provides a high-density programmable fabric with defined logic resources, embedded memory, and a large I/O count in a compact BGA package.

Key device attributes include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 341 I/O pins, and a 484-ball FPBGA (23×23) surface-mount package. The device operates from a 1.14 V to 1.575 V supply and is rated for commercial temperature range (0 °C to 85 °C).

Key Features

  • Core Logic 75,264 logic elements (cells) delivering a total gate equivalent of 3,000,000 gates for implementing complex digital logic and custom processing functions.
  • Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state machines, and local data storage within the FPGA fabric.
  • High I/O Count 341 I/O pins to accommodate wide parallel interfaces, multiple peripherals, or extensive signal routing to external devices.
  • Power and Supply Low-voltage operation with a supply range from 1.14 V to 1.575 V for compatibility with modern low-voltage systems.
  • Package & Mounting 484-ball FPBGA (23×23) package in a surface-mount form factor, offered as a 484-BGA package case for compact board-level integration.
  • Temperature & Grade Commercial-grade device specified for 0 °C to 85 °C operating temperature.
  • Environmental Compliance RoHS compliant, meeting common environmental restriction requirements for lead-free assembly.

Unique Advantages

  • High logic density: 75,264 logic elements and 3,000,000 gates provide capacity for substantial custom digital integration without multiple discrete components.
  • Embedded on-chip memory: Approximately 0.516 Mbits of RAM reduces external memory dependency for many buffering and state storage tasks.
  • Extensive I/O resources: 341 I/Os simplify interfacing to multiple peripherals, sensors, and parallel buses on a single device.
  • Compact BGA footprint: 484-FPBGA (23×23) surface-mount package enables high-density board layouts while maintaining a large pin count.
  • Low-voltage operation: 1.14 V to 1.575 V supply range supports integration into modern low-voltage system architectures.
  • RoHS compliant: Conforms to environmental requirements for lead-free manufacturing and assembly.

Why Choose M1A3PE3000L-1FGG484?

The M1A3PE3000L-1FGG484 positions itself as a feature-rich commercial-grade FPGA combining significant logic capacity, embedded memory, and a high I/O count in a compact 484-ball BGA package. Its low-voltage operation and RoHS compliance make it suitable for contemporary electronic designs that require dense programmable logic and on-chip resources.

This device is appropriate for engineers and procurement teams seeking a Microchip Technology FPGA with specified logic, memory, I/O, and package characteristics for scalable digital designs where board space and integration density are important considerations.

Request a quote or contact sales to discuss availability and pricing for the M1A3PE3000L-1FGG484.

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