M1A3PE3000L-1FGG896I

The M1A3PE3000L-1FGG896I is a ProASIC3L FPGA from Microchip Technology designed for industrial applications requiring substantial programmable logic and high I/O density. Built around a fabric offering 75,264 logic elements (approximately 3,000,000 gates) and roughly 0.52 Mbits of embedded memory, it delivers on-chip resources for complex glue logic, protocol bridging, and control implementations.

With a 620-pin I/O footprint, a compact 896-BGA (896-FBGA, 31×31) package, and a wide operating temperature range, this device is targeted at systems that demand integration, stable operation across environments, and a high degree of I/O connectivity.

Key Features

• Core Logic  75,264 logic elements providing approximately 3,000,000 gates for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for local buffering, FIFOs, and small-data storage.
• I/O Density  620 programmable I/O pins to support multiple interfaces and high pin-count system integration.
• Power  Operates from a supply range of 1.14 V to 1.575 V to match system power-rail requirements.
• Package & Mounting  896-BGA (896-FBGA, 31×31) surface-mount package for high-density board designs.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement control logic, protocol conversion, and sensor interfacing while withstanding industrial temperature ranges.
• Embedded Systems  Provide glue logic and custom peripheral implementation using abundant logic elements and on-chip RAM.
• High-Density I/O Systems  Integrate multiple parallel and serial interfaces leveraging 620 I/O pins for complex connectivity.

Unique Advantages

• High Logic Capacity:  75,264 logic elements enable substantial on-chip implementation of custom digital functions without external PLD resources.
• Significant Gate Count:  Approximately 3,000,000 gates provides the raw logic capability needed for complex algorithms and control paths.
• Large I/O Count:  620 I/O pins simplify system integration by reducing the need for external interface components.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, High-Density Package:  896-BGA (31×31) footprint supports PCB space-efficient layouts for modern board designs.
• RoHS Compliant:  Meets environmental compliance requirements for lead-free assembly.

Why Choose M1A3PE3000L-1FGG896I?

The M1A3PE3000L-1FGG896I positions itself as a resource-rich FPGA option for designs that require a combination of substantial logic, on-chip memory, and extensive I/O in a compact package. Its industrial temperature rating and surface-mount 896-BGA package make it suitable for embedded and industrial systems that need reliable operation across varying conditions.

Backed by Microchip Technology and offering a balanced mix of logic capacity, memory, and connectivity, this device supports scalable designs where integration and robustness matter, reducing board-level complexity while enabling flexible programmable implementations.

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