M1A3PE3000L-1PQG208

The M1A3PE3000L-1PQG208 is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 208-pin BFQFP surface-mount package. It provides a mix of logic capacity, on-chip memory and I/O count targeted at commercial electronic designs.

With 3,000,000 gates, 75,264 logic elements and approximately 0.516 Mbits of embedded memory, this device addresses designs that require significant programmable logic density while operating from a low supply voltage range of 1.14 V to 1.575 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  75,264 logic elements (cells) and 3,000,000 gates provide substantial programmable logic resources for complex combinational and sequential implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support data buffering, state storage and local memory functions without external SRAM.
• I/O Resources  147 user I/O pins available for interfacing to peripherals, sensors and external devices in a compact package.
• Low-Voltage Core  Core supply range from 1.14 V to 1.575 V enables compatibility with low-voltage system domains and power-optimized designs.
• Package and Mounting  Supplied in a 208-BFQFP (supplier package: 208-PQFP, 28×28 mm) surface-mount package for board-level integration and manufacturing.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for a wide range of commercial electronics applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing and assembly.

Typical Applications

• Embedded Control  Use the FPGA as programmable control logic for commercial embedded systems that benefit from high gate counts and flexible I/O.
• Interface and Glue Logic  Implement bus bridging, protocol adaptation and I/O expansion using the device’s abundant I/O and logic resources.
• Data Buffering and Local Processing  Leverage the embedded RAM and large logic fabric for on-chip buffering, datapath processing and custom state machines.

Unique Advantages

• High Logic Density: 3,000,000 gates and 75,264 logic elements enable implementation of complex logic functions without excessive partitioning.
• Integrated On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependency on external memory and simplifies board design.
• Generous I/O Count: 147 I/Os support multiple peripherals and external interfaces from a single device, lowering component count.
• Compact Surface-Mount Package: The 208-BFQFP (28×28 mm) package balances pin density and PCB routing for many commercial designs.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronics deployment.
• RoHS Compliance: Supports lead-free manufacturing and environmental conformity for commercial products.

Why Choose M1A3PE3000L-1PQG208?

The M1A3PE3000L-1PQG208 positions itself as a high-capacity, commercially rated FPGA that combines substantial logic and memory resources with a practical I/O complement and a compact BFQFP package. It is well suited to engineers needing programmable logic for advanced control, interfacing and on-chip processing while maintaining low-voltage operation and RoHS compliance.

Backed by Microchip Technology, the device fits designs that require scalable logic density and reliable commercial-grade operation, enabling streamlined BOMs and reduced reliance on external components for memory and glue logic.

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