M1A3PE3000L-FG484
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA |
|---|---|
| Quantity | 988 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 341 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of M1A3PE3000L-FG484 – ProASIC3L Field Programmable Gate Array (FPGA), 484-BGA
The M1A3PE3000L-FG484 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for applications that require high logic capacity and dense I/O. It integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory to implement complex digital functions and custom logic in a compact 484-ball BGA package.
With 341 user I/O pins, a supply voltage range of 1.14 V to 1.575 V, and commercial temperature rating (0 °C to 85 °C), the device targets surface-mount designs where gate density, on-chip RAM and compact packaging are primary design drivers.
Key Features
- Logic Capacity 75,264 logic elements enabling implementation of large-scale digital logic and custom processing blocks within a single FPGA.
- On‑Chip Memory Approximately 0.516 Mbits of total RAM bits for embedded storage, buffering and state-machine implementation.
- I/O Density 341 user I/O pins to support multiple external interfaces and parallel signal routing in I/O-intensive designs.
- Gate Count 3,000,000 gates for substantial combinational and sequential logic resources.
- Package and Mounting 484-ball BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Power Supply Range Operates from 1.14 V to 1.575 V supply, providing clear voltage requirements for system power design.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial applications.
Typical Applications
- Custom digital logic and prototyping Implement complex state machines, protocol handlers or algorithm acceleration using the device’s high logic element count and on‑chip RAM.
- I/O‑dense interface control Manage multiple parallel interfaces or aggregate serial links with the FPGA’s 341 I/O pins and configurable logic resources.
- Embedded system integration Consolidate discrete functions into a single programmable device to reduce board space and simplify design in commercial electronic products.
Unique Advantages
- High logic density: 75,264 logic elements and 3,000,000 gates provide the capacity to implement sizable digital systems without external glue logic.
- On‑chip memory resources: Approximately 0.516 Mbits of RAM support buffering, lookup tables and state retention directly on the device.
- Expanded I/O capability: 341 I/O pins allow flexible interfacing to sensors, peripherals and external memory buses.
- Compact BGA package: 484-ball FPBGA (23×23) enables a small PCB footprint and high pin count in surface-mount assemblies.
- Clear power and thermal profile: Defined supply voltage range (1.14 V–1.575 V) and commercial temperature rating facilitate predictable integration into system power and thermal budgets.
- RoHS compliant: Conforms to RoHS requirements for environmentally conscious commercial products.
Why Choose M1A3PE3000L-FG484?
The M1A3PE3000L-FG484 positions itself as a high-capacity, commercially graded FPGA option for designers needing substantial logic resources, embedded memory and a large number of I/O in a compact BGA package. Its combination of 75,264 logic elements, roughly 0.516 Mbits of on‑chip RAM and 341 I/O pins makes it suitable for consolidating multiple functions and reducing component count in surface-mount designs.
Backed by Microchip Technology’s ProASIC3L family characteristics, this device is appropriate for teams focused on scalable, board-level integration where gate density, memory and I/O availability directly impact system architecture and BOM simplification.
Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000L-FG484 and support for incorporating it into your next design.

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