M1A3PE3000L-FG484

IC FPGA 341 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

Quantity 988 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O341Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000L-FG484 – ProASIC3L Field Programmable Gate Array (FPGA), 484-BGA

The M1A3PE3000L-FG484 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for applications that require high logic capacity and dense I/O. It integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory to implement complex digital functions and custom logic in a compact 484-ball BGA package.

With 341 user I/O pins, a supply voltage range of 1.14 V to 1.575 V, and commercial temperature rating (0 °C to 85 °C), the device targets surface-mount designs where gate density, on-chip RAM and compact packaging are primary design drivers.

Key Features

  • Logic Capacity  75,264 logic elements enabling implementation of large-scale digital logic and custom processing blocks within a single FPGA.
  • On‑Chip Memory  Approximately 0.516 Mbits of total RAM bits for embedded storage, buffering and state-machine implementation.
  • I/O Density  341 user I/O pins to support multiple external interfaces and parallel signal routing in I/O-intensive designs.
  • Gate Count  3,000,000 gates for substantial combinational and sequential logic resources.
  • Package and Mounting  484-ball BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
  • Power Supply Range  Operates from 1.14 V to 1.575 V supply, providing clear voltage requirements for system power design.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial applications.

Typical Applications

  • Custom digital logic and prototyping  Implement complex state machines, protocol handlers or algorithm acceleration using the device’s high logic element count and on‑chip RAM.
  • I/O‑dense interface control  Manage multiple parallel interfaces or aggregate serial links with the FPGA’s 341 I/O pins and configurable logic resources.
  • Embedded system integration  Consolidate discrete functions into a single programmable device to reduce board space and simplify design in commercial electronic products.

Unique Advantages

  • High logic density: 75,264 logic elements and 3,000,000 gates provide the capacity to implement sizable digital systems without external glue logic.
  • On‑chip memory resources: Approximately 0.516 Mbits of RAM support buffering, lookup tables and state retention directly on the device.
  • Expanded I/O capability: 341 I/O pins allow flexible interfacing to sensors, peripherals and external memory buses.
  • Compact BGA package: 484-ball FPBGA (23×23) enables a small PCB footprint and high pin count in surface-mount assemblies.
  • Clear power and thermal profile: Defined supply voltage range (1.14 V–1.575 V) and commercial temperature rating facilitate predictable integration into system power and thermal budgets.
  • RoHS compliant: Conforms to RoHS requirements for environmentally conscious commercial products.

Why Choose M1A3PE3000L-FG484?

The M1A3PE3000L-FG484 positions itself as a high-capacity, commercially graded FPGA option for designers needing substantial logic resources, embedded memory and a large number of I/O in a compact BGA package. Its combination of 75,264 logic elements, roughly 0.516 Mbits of on‑chip RAM and 341 I/O pins makes it suitable for consolidating multiple functions and reducing component count in surface-mount designs.

Backed by Microchip Technology’s ProASIC3L family characteristics, this device is appropriate for teams focused on scalable, board-level integration where gate density, memory and I/O availability directly impact system architecture and BOM simplification.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000L-FG484 and support for incorporating it into your next design.

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