M1A3PE3000L-FG896I

The M1A3PE3000L-FG896I is a ProASIC3L field programmable gate array (FPGA) designed for industrial-grade programmable logic applications. It provides a high-density fabric with 75,264 logic elements and approximately 0.516 Mbits of embedded memory to implement complex custom logic.

With 620 I/O pins, a core gate count of 3,000,000, an 896-ball BGA package, and an operating range from -40 °C to 100 °C, this device targets industrial designs that require significant I/O, on-chip logic capacity, and a wide operating temperature range.

Key Features

• Core Logic 
  75,264 logic elements delivering capacity for complex programmable logic implementations and system integration.
• Embedded Memory 
  Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Density 
  620 I/O pins to support high-pin-count interfaces and multiple parallel signal connections.
• Gate Count 
  3,000,000 gates providing significant combinational and sequential resource availability.
• Power Supply Range 
  Operates from 1.14 V to 1.575 V, accommodating the specified core voltage requirements for system design.
• Package 
  896-ball FBGA (31 × 31) surface-mount package for compact, high-density board integration.
• Temperature Range 
  Industrial operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Mounting & Compliance 
  Surface-mount package construction and RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

• Industrial control and automation 
  High logic capacity and industrial temperature rating support custom control, sequencing, and interface tasks in factory and process environments.
• I/O-intensive embedded systems 
  620 I/O pins enable designs requiring large numbers of external connections, sensors, or parallel interfaces.
• Prototyping and custom logic development 
  Ample logic elements and on-chip RAM make the device suitable for developing and validating custom FPGA-based functions.
• Interface bridging and protocol handling 
  High gate count and abundant I/O support implementation of protocol translation and multi-interface aggregation within a single device.

Unique Advantages

• High logic capacity: 75,264 logic elements and 3,000,000 gates provide the resources needed for complex, integrated FPGA designs.
• Substantial I/O availability: 620 I/O pins reduce the need for external multiplexing or additional interface components in I/O-heavy applications.
• Embedded memory on-chip: Approximately 0.516 Mbits of RAM supports local buffering and state storage without external memory for many use cases.
• Industrial temperature support: Rated from -40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Compact, high-density packaging: 896-FBGA (31 × 31) enables integration in space-constrained board designs while maintaining a large I/O count.
• RoHS compliant: Meets environmental lead-free requirements for modern manufacturing processes.

Why Choose M1A3PE3000L-FG896I?

The M1A3PE3000L-FG896I balances substantial logic capacity, extensive I/O, and embedded memory within an industrial-grade FPGA package. Its feature set is tailored for designers needing a programmable solution that can handle complex logic, numerous external interfaces, and operation across a wide temperature range.

This device is well suited to engineers and procurement teams targeting industrial control, I/O-dense embedded systems, and custom logic implementations where on-chip resources and environmental robustness are key considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000L-FG896I. Our team can assist with lead times and order details.