M1A3PE3000L-FG896

The M1A3PE3000L-FG896 is a commercial-grade Field Programmable Gate Array (FPGA) IC providing a high-density programmable logic resource in a compact 896-ball BGA package. It combines a large number of logic elements, on-chip embedded memory, and extensive I/O to support complex digital designs and system-level integration.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this part is targeted at commercial electronic designs that require significant logic capacity and high I/O counts in a surface-mount BGA footprint.

Key Features

• Logic Capacity  Provides 75,264 logic elements, enabling substantial combinational and sequential logic integration for complex digital functions.
• Gate Count  Approximately 3,000,000 gates to support intricate logic implementations and design scaling.
• Embedded Memory  Includes approximately 0.52 Mbits of on-chip RAM (516,096 bits) for local data storage, buffering, and state retention.
• High I/O Density  620 general-purpose I/Os that accommodate multiple interfaces and high-pin-count connectivity requirements.
• Power  Operates from a core supply range of 1.14 V to 1.575 V, allowing designers to match system power domains and manage board-level power planning.
• Package & Mounting  Supplied in an 896-FBGA (31 × 31) package case and designed for surface-mount assembly for compact, board-level implementation.
• Commercial Grade  Rated for 0 °C to 85 °C operation and specified as commercial grade for general-purpose electronic applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to implement custom logic, digital peripherals, and control functions in space-constrained commercial devices.
• High-Density I/O Consolidation  Leverage 620 I/Os to consolidate multiple interfaces or bridge diverse peripherals onto a single programmable device.
• Custom Logic and Prototyping  Deploy the device for developing and validating complex digital architectures that require substantial logic elements and on-chip memory.

Unique Advantages

• Highly Integrated Logic Resource: 75,264 logic elements deliver a large programmable fabric for implementing complex digital systems without external ASICs.
• Significant On-Chip Memory: Approximately 0.52 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O Capacity: 620 I/Os enable dense connectivity and multi-interface integration on a single device, simplifying board design.
• Compact BGA Packaging: The 896-FBGA (31 × 31) package provides a high-pin-count solution in a compact surface-mount form factor suitable for space-constrained PCBs.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for deployment in commercial electronic products.

Why Choose M1A3PE3000L-FG896?

The M1A3PE3000L-FG896 offers a balanced combination of high logic density, on-chip memory, and large I/O capacity in a compact 896-BGA package, making it well suited for commercial applications that require substantial programmable logic and dense connectivity. Its electrical and thermal specifications support integration into standard commercial designs while maintaining a streamlined BOM through on-chip resources.

Choose this FPGA when your design demands significant logic resources, substantial I/O pin count, and a surface-mount BGA footprint that supports compact PCB layouts and system-level consolidation.

Request a quote or submit an inquiry to obtain pricing and availability for M1A3PE3000L-FG896.