M1A3PE3000L-FG896M

The M1A3PE3000L-FG896M is a ProASIC3L family Field Programmable Gate Array (FPGA) from Microchip Technology designed for high-density, mission-focused logic integration. It delivers substantial logic capacity and I/O density in a surface-mount 896-FBGA (31×31) package, and is qualified to military standards for use in applications requiring wide operating temperature and formal qualification.

This device is positioned for systems that require a combination of large logic resources, significant embedded memory, and robust environmental qualification for deployment in demanding operating conditions.

Key Features

• Logic Capacity 75,264 logic elements providing extensive programmable logic resources and support for complex custom designs; equivalent to approximately 3,000,000 gates.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and intermediate processing.
• I/O Density 620 user I/O pins to support high-pin-count interfacing and multi-channel connectivity in complex systems.
• Supply Voltage Operates from 1.425 V to 1.575 V, enabling defined power domain integration with compatible system rails.
• Package & Mounting 896-FBGA (31×31) package in a surface-mount form factor for compact, high-density PCB layouts.
• Qualification & Grade Military grade with MIL-STD-883 qualification for applications that require verified manufacturing and test processes.
• Operating Temperature Rated for −55 °C to 125 °C to support deployment across extreme temperature environments.

Typical Applications

• Defense & Aerospace Systems Suited for mission-critical logic functions where MIL-STD-883 qualification and wide temperature range are required.
• High-density Interface and Carrier Processing High I/O count and large logic capacity enable aggregation and control of multiple high-speed interfaces and bridging functions.
• Signal Processing and Custom Logic Large number of logic elements and embedded memory support implementation of custom signal conditioning, filtering, and control algorithms.
• Communications Equipment Use in subsystem roles that require significant programmable logic and many external connections for protocol handling and data routing.

Unique Advantages

• Military-qualified reliability: MIL-STD-883 qualification and a −55 °C to 125 °C rating support deployment in environmentally demanding and mission-critical systems.
• High logic integration: 75,264 logic elements and ~3,000,000 gates enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 0.516 Mbits of embedded RAM for local buffering and state retention without external memory.
• Exceptional I/O capacity: 620 I/O pins accommodate complex multi-channel interfaces and high connector count designs.
• Compact high-density packaging: 896-FBGA (31×31) surface-mount package allows dense PCB layouts while providing large I/O counts.
• Defined power domain: Narrow supply range (1.425 V–1.575 V) simplifies power system design for devices optimized around that rail.

Why Choose M1A3PE3000L-FG896M?

The M1A3PE3000L-FG896M combines substantial programmable logic, a significant complement of embedded memory, and very high I/O density in a military-grade, MIL-STD-883–qualified package. It is well-suited to engineers designing mission-focused systems that demand rugged qualification, wide temperature operation, and the ability to consolidate complex functionality into a single FPGA.

As a Microchip Technology ProASIC3L device, this FPGA offers a platform for scalable, robust designs where long-term field performance and high integration density are essential design considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the M1A3PE3000L-FG896M.