M1A3PE3000L-FGG896

The M1A3PE3000L-FGG896 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It delivers up to 3,000,000 gates and 75,264 logic elements in a high-density, reconfigurable silicon fabric.

With 620 user I/O pins, approximately 0.516 Mbits of embedded memory, and a compact 896-BGA supplier package, this device is intended for commercial designs that require substantial on-chip logic capacity, significant I/O integration, and a low-voltage core supply.

Key Features

• Core Logic 75,264 logic elements providing a 3,000,000-gate equivalent capacity for implementing complex digital designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs, and small data stores within the programmable fabric.
• I/O Density 620 user I/O pins to support extensive board-level interfacing and parallel connectivity.
• Power Supply Core voltage range from 1.14 V to 1.575 V, enabling design flexibility for low-voltage system architectures.
• Package & Mounting 896-BGA supplier device package (896-FBGA, 31×31) with surface-mount mounting for compact, high-density PCB integration.
• Operating Range Commercial-grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant for regulatory and manufacturing alignment.

Typical Applications

• Custom digital logic — Implement application-specific state machines, datapaths, and control logic using the device's large logic element count.
• I/O-heavy systems — Serve as a central interface hub where high I/O count is needed for parallel buses, sensors, or peripheral aggregation.
• Prototyping and development — Validate and iterate complex digital designs that require reprogrammable logic and embedded memory.
• Glue logic and protocol bridging — Consolidate discrete interfacing functions into a single programmable device to simplify PCB routing and reduce component count.

Unique Advantages

• Substantial logic capacity: 75,264 logic elements and 3,000,000 gates provide headroom for mid- to large-scale digital implementations without resorting to multiple devices.
• High I/O integration: 620 I/O pins enable direct connectivity to multiple peripherals and parallel interfaces, reducing the need for external multiplexers or port expanders.
• Embedded memory on-chip: Approximately 0.516 Mbits of RAM supports local buffering and fast on-chip data handling to improve system performance.
• Compact BGA package: 896-FBGA packaging supports dense PCB layouts while maintaining a surface-mount footprint for modern assembly processes.
• Low-voltage core operation: 1.14 V to 1.575 V supply range aligns with contemporary low-voltage system designs and power management strategies.
• Commercial temperature grading: Rated for 0 °C to 85 °C, suitable for a wide range of standard commercial applications.

Why Choose M1A3PE3000L-FGG896?

The M1A3PE3000L-FGG896 balances high logic capacity, extensive I/O, and embedded memory in a single ProASIC3L FPGA package from Microchip Technology. Its combination of 75,264 logic elements, 620 I/O pins, and approximately 0.516 Mbits of on-chip RAM makes it well suited for designs that require consolidated programmable logic and dense board-level interfacing.

Offered in an 896-BGA surface-mount package with RoHS compliance and commercial temperature grading, this device provides a scalable, integrated option for development and production designs where reconfigurable logic and significant I/O are priorities.

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