M1A3PE3000L-FGG896M

The M1A3PE3000L-FGG896M is a ProASIC3L flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides high logic density and a large I/O complement in a compact 896-FBGA (31×31) package targeted for designs that require military-grade qualification and extended temperature operation.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 3,000,000 gates, the device is suitable for applications that demand extensive on-chip logic and high pin counts while operating across a wide industrial-to-military temperature range.

Key Features

• Core Logic 75,264 logic elements (LEs) delivering extensive programmable logic resources for complex designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• Gate and I/O Capacity 3,000,000 gates and 620 I/O pins provide high integration for dense, interface-heavy systems.
• Package & Mounting 896-FBGA (31×31) package in a surface-mount form factor to maximize board-level routing density.
• Power Operates from a 1.425 V to 1.575 V supply range for compatibility with low-voltage system architectures.
• Temperature & Qualification Military-grade device qualified to MIL-STD-883 and rated for operation from −55 °C to 125 °C.
• Environmental Compliance RoHS compliant, supporting environmentally conscious manufacturing requirements.

Typical Applications

• Military and Aerospace Systems — Suitable for mission-critical electronics that require MIL-STD-883 qualification and extended temperature operation.
• High-Density I/O Interfaces — Ideal where large numbers of physical interfaces are needed for signal routing, switching, or protocol conversion.
• Embedded Signal and Control Processing — Use the device’s extensive logic and on-chip RAM for real-time control, data handling, and custom logic blocks.
• High-Integration Board-Level Designs — Compact 896-FBGA packaging supports space-constrained systems requiring significant logic resources.

Unique Advantages

• High Logic Density: 75,264 logic elements support complex designs and reduce the need for multiple discrete devices.
• Large I/O Count: 620 I/Os enable direct interfacing to numerous peripherals and high-pin-count systems without extensive external multiplexing.
• Qualified for Harsh Environments: MIL-STD-883 qualification and −55 °C to 125 °C range enable deployment in demanding military and aerospace environments.
• Compact, High-Pin Package: 896-FBGA (31×31) balances high I/O and routing density in space-constrained PCB layouts.
• Low-Voltage Operation: 1.425 V to 1.575 V supply supports integration into modern low-voltage system architectures.
• Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing and procurement.

Why Choose M1A3PE3000L-FGG896M?

The M1A3PE3000L-FGG896M combines substantial on-chip logic, embedded memory, and an extensive I/O complement with military-grade qualification, positioning it for demanding applications that require both integration and reliability. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 620 I/Os makes it well suited for designs that need high-density programmable logic in a single device.

Backed by Microchip Technology and qualified to MIL-STD-883, this ProASIC3L FPGA offers a durable solution for long-life deployments where extended temperature operation and regulatory compliance are required.

Request a quote or submit your specifications to receive pricing and availability information for the M1A3PE3000L-FGG896M.