M1A3PE3000L-FGG484I

The M1A3PE3000L-FGG484I is a ProASIC3L field programmable gate array from Microchip Technology. It provides a combination of logic density, on-chip memory and I/O capacity in a compact 484-BGA package for industrial-grade applications.

Key device attributes include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 341 I/O, and a supply voltage range of 1.14 V to 1.575 V, with an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic: 75,264 logic elements (cells) delivering a total of 3,000,000 gates for implementing complex digital functions.
• Embedded Memory: Approximately 0.516 Mbits of on-chip RAM (516,096 bits) to support buffering, state machines and local data storage.
• I/O Capacity: 341 I/O pins to support a wide range of external interfaces and parallel connectivity requirements.
• Power and Voltage Range: Operates from 1.14 V to 1.575 V, enabling integration into low-voltage system power domains.
• Package and Mounting: 484-ball FPBGA (23 × 23) package in a 484-BGA case, designed for surface-mount assembly.
• Temperature and Grade: Industrial-grade device rated for operation from -40 °C to 100 °C.
• Compliance: RoHS compliant.

Unique Advantages

• High logic density: 75,264 logic elements and 3,000,000 gates enable implementation of sophisticated digital designs on a single device.
• On-chip memory: Approximately 0.516 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Generous I/O count: 341 I/O pins provide flexibility for interfacing multiple peripherals and parallel buses.
• Low-voltage operation: Narrow supply range (1.14 V–1.575 V) supports integration with modern low-voltage system architectures.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in demanding environments.
• Compact BGA package: 484-FPBGA (23×23) package balances high pin count with a compact footprint for space-constrained boards.

Why Choose M1A3PE3000L-FGG484I?

The M1A3PE3000L-FGG484I positions itself as a capable FPGA option where significant logic resources, embedded memory and plentiful I/O are required in a compact, industrial-grade package. Its combination of 75,264 logic elements, approximately 0.516 Mbits of RAM and 341 I/O makes it suitable for complex digital functions while simplifying board-level memory and interface requirements.

Backed by Microchip Technology and offered in a surface-mount 484-FPBGA package, this device addresses designs that need reliable operation across a wide temperature range and compliance with RoHS requirements, supporting long-term deployment and supply-chain compatibility.

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