M1A3PE3000L-FGG484

The M1A3PE3000L-FGG484 is a commercial-grade Field Programmable Gate Array from Microchip Technology in the ProASIC3L family. It delivers high logic density and on-chip memory in a compact 484-BGA package for commercial embedded designs.

Designed for applications that require substantial programmable logic, abundant I/O and embedded memory at low supply voltages, this device balances integration and board-level space savings while meeting RoHS requirements.

Key Features

• Core Logic — 75,264 logic elements (cells) providing a total of 3,000,000 gates for complex digital implementations.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM to support state, buffering, and local data storage within logic fabric.
• I/O Density — 341 user I/O pins enabling extensive peripheral and interface connectivity in a single device.
• Power — Low-voltage operation with a supply range of 1.14 V to 1.575 V to support power-sensitive designs.
• Package & Mounting — 484-ball BGA in a 23×23 FPBGA footprint with surface-mount mounting for compact board-level integration.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial environments.
• Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Commercial Embedded Systems — Implement custom digital logic and control functions in commercial devices where high logic density and moderate temperature range are required.
• Interface Bridging and Protocol Conversion — Use the device’s 341 I/O pins to consolidate multiple interfaces and implement protocol translation in a single FPGA.
• Prototyping and Development — High gate count and abundant logic elements make it suitable for prototyping complex digital designs prior to production.
• On-board Data Buffering — Approximately 0.516 Mbits of embedded RAM supports local buffering and temporary storage for data flow management.

Unique Advantages

• High Logic Capacity: 75,264 logic elements and 3,000,000 gates enable implementation of substantial digital functions without external glue logic.
• Significant I/O Count: 341 I/O pins reduce the need for additional interface chips and simplify board routing for multi-interface designs.
• Compact BGA Footprint: 484-BGA (23×23 FPBGA) package offers a space-efficient solution for board-level density-sensitive applications.
• Low-Voltage Operation: 1.14 V to 1.575 V supply range supports designs targeting lower power domains.
• Commercial Grade and RoHS Compliant: Suitable for standard commercial deployments with eco-compliance for manufacturing.

Why Choose M1A3PE3000L-FGG484?

The M1A3PE3000L-FGG484 combines high logic density, extensive I/O, and on-chip memory in a compact 484-BGA package, making it well suited for commercial embedded and interface-focused designs. Its low-voltage operation and RoHS compliance provide practical advantages for modern board-level integration.

This device is ideal for engineers and procurement teams seeking a commercially rated FPGA that delivers substantial programmable resources and connectivity while supporting compact product designs and standard commercial temperature environments.

Request a quote or submit a purchase inquiry for the M1A3PE3000L-FGG484 to receive pricing and availability information tailored to your project needs.