M1A3PE3000L-FG484M

The M1A3PE3000L-FG484M is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a 484-ball BGA package. It provides a large programmable fabric with substantial logic and memory resources and is specified for military-grade environments.

Designed for applications that require dense logic, abundant I/O and high-reliability qualification, this device targets rugged embedded systems and defense electronics where MIL-STD-883 qualification and wide operating temperature are required.

Key Features

• Logic Resources  Approximately 75,264 logic elements providing a total of 3,000,000 gates for complex digital implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) to support buffering, state storage and local data processing.
• I/O Density  341 user I/O pins to support wide peripheral connectivity and high-pin-count interfaces.
• Power Supply  Specified core voltage range of 1.425 V to 1.575 V for predictable power integration.
• Package & Mounting  484-ball BGA package (484-FPBGA, 23×23) with surface-mount mounting for compact board implementation.
• Military Qualification  Grade: Military with qualification to MIL-STD-883, suitable for high-reliability defense and aerospace systems.
• Operating Temperature  Rated for −55°C to +125°C to meet demanding thermal environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Defense & Aerospace Electronics  Use in mission-critical processing, protocol bridging and custom logic where MIL-STD-883 qualification and wide temperature range are required.
• Rugged Embedded Control  Implementation of control logic, I/O aggregation and deterministic processing in harsh environments.
• Secure Communications  Custom packet processing, interfacing and glue logic for secure communication subsystems that need abundant logic and I/O.
• High‑Reliability Data Acquisition  Local data conditioning, buffering and pre-processing using on-chip RAM and dense logic resources for reliable sensor interfaces.

Unique Advantages

• High Logic Capacity: Large gate count (3,000,000 gates) and ~75,264 logic elements enable integration of complex digital functions into a single device, reducing board-level BOM.
• Significant On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and state storage to minimize external memory dependency.
• Abundant I/O: 341 I/O pins provide flexibility to connect multiple peripherals and high-pin-count interfaces without external multiplexing.
• Military-Grade Qualification: MIL-STD-883 qualification and military grade rating provide design assurance for defense and aerospace deployments.
• Wide Temperature Range: Specified operation from −55°C to +125°C for reliable performance across harsh thermal conditions.
• Compact BGA Package: 484-FPBGA (23×23) surface-mount package balances high I/O and density for space-constrained boards.

Why Choose M1A3PE3000L-FG484M?

The M1A3PE3000L-FG484M positions itself as a rugged, high-capacity FPGA solution for engineers developing military and high-reliability embedded systems. With 3,000,000 gates, approximately 75,264 logic elements, substantial on-chip RAM and 341 I/Os, it enables consolidation of complex logic and interfacing in a single, MIL-STD-883 qualified device.

This part is well suited for designs that prioritize robustness and long-term field performance across extreme temperatures. The combination of dense logic, memory and I/O in a compact 484-BGA package delivers scalable capability for systems that demand reliable, mission-critical operation.

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