M1A3PE3000L-1PQG208I

The M1A3PE3000L-1PQG208I is a ProASIC3L FPGA offering a programmable logic fabric for custom digital designs. It delivers 75,264 logic elements and 516,096 bits of on-chip RAM in a 208-pin BFQFP surface-mount package targeted at industrial applications.

With 147 I/O pins, a 1.14 V–1.575 V core voltage range and an operating temperature range of −40 °C to 100 °C, this device is suited for designs that require a combination of logic capacity, embedded memory, and industrial-grade environmental tolerance.

Key Features

• Logic Capacity — 75,264 logic elements (cells) providing programmable resources for complex digital functions.
• Embedded Memory — 516,096 bits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density — 147 general-purpose I/O pins to interface with sensors, peripherals, and external buses.
• Gate Count — 3,000,000 gates for modeling device complexity and integration needs.
• Power Supply — Core supply range of 1.14 V to 1.575 V to match system power architectures and regulator choices.
• Package & Mounting — 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
• Industrial Temperature Grade — Operating temperature range from −40 °C to 100 °C appropriate for industrial environments.
• RoHS Compliant — Meets lead-free and hazardous substance requirements for modern manufacturing.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature rating and abundant logic elements for control logic, sequencing, and interface bridging in factory equipment.
• I/O-Intensive Interfaces — 147 I/O pins enable dense sensor, actuator, and peripheral interfacing without additional I/O expanders.
• On-Device Data Buffering — 516,096 bits of embedded RAM support local buffering and data handling for real-time processing tasks.
• Space-Constrained PCB Designs — The 208-BFQFP surface-mount package provides a compact footprint for applications requiring a high-pin-count FPGA in a standard package.

Unique Advantages

• High Logic Density: 75,264 logic elements let you implement substantial custom logic without moving to external programmable devices.
• Substantial On-Chip Memory: 516,096 bits of RAM reduce the need for external memory components, simplifying BOM and board layout.
• Robust Industrial Range: Specified operation from −40 °C to 100 °C supports deployment in industrial settings and temperature-challenging environments.
• Flexible I/O: 147 I/O pins provide versatility for complex interface requirements and parallel I/O schemes.
• Standard Surface-Mount Package: 208-BFQFP (28 × 28 mm) offers a familiar package for volume assembly and reflow processes.
• Regulatory Readiness: RoHS compliance aligns with common environmental requirements in global manufacturing.

Why Choose M1A3PE3000L-1PQG208I?

The M1A3PE3000L-1PQG208I positions itself as a robust FPGA option for industrial and embedded designs that require substantial logic resources, on-chip memory, and a high number of I/Os in a surface-mount 208-pin package. Its operating range and RoHS compliance make it suitable for production environments where reliability and regulatory alignment matter.

Designers and procurement teams seeking a programmable, on-board logic solution with a balance of capacity, memory, and industrial-grade environmental tolerance will find this ProASIC3L device a practical choice for mid- to high-complexity digital systems.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional ordering information for M1A3PE3000L-1PQG208I.