M1A3PE3000L-1PQ208

The M1A3PE3000L-1PQ208 is a ProASIC3L field programmable gate array (FPGA) IC designed for commercial electronic designs. It provides a programmable logic fabric with a high logic element count and embedded memory, packaged in a 208-pin BFQFP form factor.

This device targets applications that require substantial on-chip logic capacity and a large number of I/O signals while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  75,264 logic elements (cells) delivering programmable gate capacity equivalent to 3,000,000 gates for implementing complex custom logic.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) to support data buffering, state storage, and local memory needs.
• I/O and Connectivity  147 user I/O pins to accommodate high-pin-count interfacing and multiple peripheral connections.
• Power  Core supply range from 1.14 V to 1.575 V to match system power architectures and enable predictable power integration.
• Package & Mounting  208-BFQFP package (supplier package: 208-PQFP, 28×28) in a surface-mount form factor suitable for automated PCB assembly.
• Operating Range & Compliance  Commercial operating temperature range 0 °C to 85 °C and RoHS compliant for environmental regulatory alignment.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, peripheral interfacing, and protocol handling in commercial electronic products requiring substantial on-chip logic and I/O.
• High I/O Control  Use the 147 I/Os for designs that need multiple parallel interfaces, sensor arrays, or display/control connections.
• Custom Logic Implementation  Deploy the 75,264 logic elements and on-chip RAM to realize specialized datapaths, state machines, and control logic without external gate arrays.

Unique Advantages

• High Logic Capacity:  75,264 logic elements and 3,000,000 gates enable dense integration of complex logic functions on a single device.
• On-Chip Memory:  Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for control and buffering tasks.
• Large I/O Count:  147 I/Os simplify board-level routing for multi-signal systems and reduce the need for external I/O expanders.
• Commercial-Grade Availability:  Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial product environments.
• Surface-Mount 208-BFQFP Package:  A compact, assembly-friendly package that balances I/O density with manufacturability.
• Flexible Core Supply:  1.14 V to 1.575 V supply range supports integration into a variety of commercial power domains.

Why Choose M1A3PE3000L-1PQ208?

The M1A3PE3000L-1PQ208 combines a large logic fabric, meaningful embedded memory, and a high I/O count in a surface-mount 208-pin package, positioning it for commercial designs that require integrated programmable logic and extensive interfacing. Its specified operating temperature range and RoHS compliance make it appropriate for standard commercial product deployments.

This device is well suited for designers seeking a single-chip solution to consolidate custom logic, I/O handling, and on-chip memory, helping to reduce board complexity and component count while maintaining predictable supply and thermal requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the M1A3PE3000L-1PQ208.