M1A3PE3000L-1FGG484M

IC FPGA 341 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

Quantity 1,145 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O341Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits516096

Overview of M1A3PE3000L-1FGG484M – ProASIC3L Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA

The M1A3PE3000L-1FGG484M is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a 484-BGA surface-mount package. It provides a combination of high logic density, substantial embedded memory, and a high I/O count for designs that require qualified, ruggedized programmable logic.

Designed and qualified for military applications, this device is MIL-STD-883 qualified and rated for operation from -55°C to 125°C, making it suitable for electronics requiring proven qualification and extended-temperature reliability.

Key Features

  • Logic Capacity  Provides 75,264 logic elements for implementing complex custom logic and state machines.
  • Embedded Memory  Includes approximately 0.5 Mbits (516,096 bits) of on-chip RAM to support buffering, FIFO, and local data storage.
  • I/O Count  Offers 341 I/O pins to support dense peripheral and interface requirements without extensive external multiplexing.
  • Gate Count  Approximately 3,000,000 gates of programmable logic to accommodate sophisticated designs.
  • Power  Specified for a core voltage supply range of 1.425 V to 1.575 V.
  • Package & Mounting  Supplied in a 484-FPBGA (23×23) 484-BGA package, surface-mount for compact PCB integration.
  • Temperature & Qualification  Military grade with MIL-STD-883 qualification and an operating temperature range of -55°C to 125°C for deployments in demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Military and Aerospace Electronics  Use where MIL-STD-883 qualification and extended-temperature operation are required for mission-critical systems.
  • High-I/O Embedded Systems  Deploy in designs that require many external interfaces or sensors, leveraging 341 available I/Os.
  • On-Chip Logic and Memory Integration  Implement complex logic and local data buffering using 75,264 logic elements and approximately 0.5 Mbits of embedded RAM.
  • Ruggedized Control and Signal Processing  Suitable for embedded control or processing tasks in environments demanding wide temperature ranges and qualified components.

Unique Advantages

  • MIL-STD-883 Qualification:  Provides military-level qualification for designers specifying certified components.
  • Extended Operating Temperature:  Rated from -55°C to 125°C for use in extreme environmental conditions.
  • High Logic Density:  75,264 logic elements enable integration of complex custom logic on a single device, reducing external component count.
  • Substantial On-Chip Memory:  Approximately 0.5 Mbits of embedded RAM for local storage, reducing dependency on external memory.
  • Large I/O Complement:  341 I/Os support extensive interfacing options and simplify board-level design.
  • Compact BGA Package:  484-FPBGA (23×23) surface-mount package supports high-density PCB layouts while maintaining routing capability.

Why Choose M1A3PE3000L-1FGG484M?

This ProASIC3L FPGA is positioned for designs that require a qualified, high-density programmable logic device with robust environmental tolerance. Its combination of 75,264 logic elements, approximately 0.5 Mbits of embedded RAM, and 341 I/Os makes it a practical choice for engineers developing military-grade and rugged embedded systems.

Manufactured by Microchip Technology and supplied in a 484-BGA surface-mount package, the M1A3PE3000L-1FGG484M supports long-term deployments where MIL-STD-883 qualification, wide temperature operation, and compact board integration are priorities.

Request a quote or submit an inquiry to obtain pricing and availability for the M1A3PE3000L-1FGG484M.

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