M1A3PE3000L-1FG896M

The M1A3PE3000L-1FG896M is a ProASIC3L field programmable gate array from Microchip Technology, offered in a 896-ball BGA package. It delivers a balanced combination of logic capacity, I/O density and on-chip memory tailored for designs requiring military-grade qualification and wide operating temperature range.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 620 I/O, this device is suited for high-reliability embedded systems where MIL-STD-883 qualification and extended temperature operation are required.

Key Features

• Logic Capacity  75,264 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM supports buffering, state storage and data processing tasks.
• I/O Density  620 I/O pins enable extensive peripheral interfacing and system interconnects in a single device.
• Gate Count  3,000,000 gates for implementing large-scale logic and control functions.
• Power and Supply  Specified supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package and Mounting  896-ball FBGA (31 × 31 mm) package, surface-mount compatible, for compact board integration.
• Environmental & Reliability  Military grade construction with MIL-STD-883 qualification and RoHS compliance for regulated environments.
• Operating Range  Wide operating temperature range from −55 °C to 125 °C for deployment in harsh and temperature-extreme applications.

Typical Applications

• Defense & Aerospace  Military-qualified FPGA suitable for control, signal processing and I/O aggregation in ruggedized systems.
• High-Reliability Embedded Systems  Use in mission-critical electronics where extended temperature range and MIL-STD-883 qualification are required.
• Communication and Data Interfaces  High I/O count supports dense protocol interfacing and board-level data routing.

Unique Advantages

• High Logic Density: 75,264 logic elements permit implementation of complex control and signal-processing functions on a single device, reducing system-level component count.
• Substantial On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Extensive I/O Capability: 620 I/O pins enable flexible connectivity to sensors, converters and high-pin-count subsystems.
• Rugged Qualification: MIL-STD-883 qualification and military grade rating provide traceable reliability for regulated and high-reliability projects.
• Wide Thermal and Voltage Margins: Operation from −55 °C to 125 °C and a defined supply range of 1.425–1.575 V help ensure predictable behavior across demanding environments.
• Compact BGA Package: 896-FBGA (31 × 31 mm) packaging delivers high density in a surface-mount footprint for space-constrained boards.

Why Choose M1A3PE3000L-1FG896M?

The M1A3PE3000L-1FG896M positions itself as a capable FPGA option for designs that prioritize logic capacity, high I/O count and military-grade reliability. Its combination of logic elements, on-chip memory and extensive I/O in a compact 896-ball BGA makes it suitable for complex embedded systems that must operate across a wide temperature range and meet MIL-STD-883 requirements.

This device is a practical choice for engineers and procurement teams building ruggedized communication, control and processing platforms where long-term robustness and regulatory qualification are essential. RoHS compliance and defined electrical and thermal specifications support predictable integration into regulated product lines.

Request a quote or submit an inquiry for availability and pricing to evaluate the M1A3PE3000L-1FG896M for your next project.