M1A3PE3000L-1FGG896

The M1A3PE3000L-1FGG896 is a ProASIC3L Field Programmable Gate Array (FPGA) IC providing 3,000,000 gates and 75,264 logic elements in a compact 896-BGA package. It delivers a combination of on-chip memory, extensive I/O, and a low-voltage supply range suitable for commercial-temperature programmable logic implementations.

Key device attributes include approximately 0.516 Mbits of embedded memory, up to 620 I/O pins, surface-mount 896-FBGA (31×31) packaging, RoHS compliance, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 3,000,000 gates and 75,264 logic elements provide a large programmable fabric for implementing complex custom logic and system functions.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and small lookup tables directly within the FPGA fabric.
• I/O Density Up to 620 I/O pins support extensive external interfacing and parallel connectivity in a single device.
• Power Supported supply voltage range from 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting Supplied in a 896-FBGA (31×31) surface-mount package (896-BGA case) for high-density board integration.
• Temperature and Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Commercial embedded systems — Programmable logic integration where a high gate count and large I/O complement system-level functionality within commercial temperature ranges.
• Custom protocol bridging — Use the abundant I/O and logic elements to implement interface translation and protocol handling in compact board designs.
• Control and glue logic — Replace multiple discrete components with on-chip logic and embedded RAM to reduce board complexity and component count.

Unique Advantages

• High logic capacity: 3,000,000 gates and 75,264 logic elements enable implementation of sizeable custom logic and multi-functional designs.
• Significant on-chip memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Extensive I/O: Up to 620 I/O pins provide broad interfacing options for peripherals, sensors, and external logic.
• Compact BGA package: 896-FBGA (31×31) surface-mount package offers high pin density in a space-efficient footprint.
• Low-voltage operation: 1.14 V to 1.575 V supply range aligns with modern low-voltage system domains.
• RoHS compliant: Meets environmental compliance requirements for many manufacturing flows.

Why Choose M1A3PE3000L-1FGG896?

The M1A3PE3000L-1FGG896 positions a large FPGA fabric, meaningful on-chip memory, and extensive I/O within a single, RoHS-compliant 896-BGA package rated for commercial temperature operation. Its combination of capacity and compact packaging supports designs that require substantial programmable logic while conserving board area and component count.

This device is well suited for designers seeking a high-gate-count FPGA solution for commercial embedded systems, protocol implementation, and consolidating control logic. The defined supply-voltage range and operating-temperature specification make it straightforward to integrate into existing low-voltage commercial designs.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3PE3000L-1FGG896 and to discuss how it can fit into your next programmable-logic design.