M1A3PE3000L-1FGG896M

The M1A3PE3000L-1FGG896M is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It delivers a high logic capacity FPGA fabric paired with substantial I/O resources and embedded memory for complex, high-reliability designs.

Designed and qualified for military use, this device supports demanding temperature and qualification requirements while providing a compact 896-ball FBGA package and a defined supply voltage range for predictable system integration.

Key Features

• Logic Capacity — Provides 75,264 logic elements (cells) and approximately 3,000,000 gates to implement complex custom logic and parallel processing functions.
• Embedded Memory — Includes 516,096 bits of on-chip RAM, approximately 0.52 Mbits of embedded memory for buffering, FIFOs, and small data stores.
• High I/O Count — 620 user I/O pins to support wide bus interfaces, multiple parallel data channels, or dense peripheral connectivity.
• Power and Supply — Operates from a defined core voltage range of 1.425 V to 1.575 V for consistent power design and margin planning.
• Package and Mounting — Supplied in an 896-FBGA (31 × 31) package, surface-mount mounting for compact board layouts and high I/O density.
• Qualification and Grade — Military grade device qualified to MIL-STD-883, supporting applications that require formal military-level qualification.
• Thermal Range — Rated for operation from −55 °C to 125 °C to meet wide temperature environmental requirements.

Typical Applications

• Military & Aerospace Systems — Use in mission-critical subsystems where MIL-STD-883 qualification and wide operating temperature are required; high logic count and I/O support sensor interfaces and custom processing.
• High-Reliability Embedded Control — Suitable for embedded controllers and deterministic logic tasks that demand long-term stability and defined supply/temperature envelopes.
• Communications and Signal Processing — Dense I/O and sizable gate count enable implementation of parallel data paths, protocol bridging, and real-time signal processing functions.
• Custom Hardware Acceleration — Implement application-specific accelerators and control logic where substantial logic elements and embedded memory are needed on a single device.

Unique Advantages

• High Logic Integration: 75,264 logic elements and roughly 3,000,000 gates enable integration of large custom designs onto a single FPGA to reduce system complexity.
• Significant I/O Density: 620 I/O pins allow direct interfacing to multiple high-speed buses, sensors, and peripheral arrays without extensive external glue logic.
• Qualified for Military Use: MIL-STD-883 qualification and a military grade designation support deployment in regulated, high-reliability programs.
• Wide Operating Temperature: Rated from −55 °C to 125 °C for reliable operation across harsh environmental conditions.
• Compact Board Footprint: 896-FBGA (31 × 31) package provides a balance of high pin-count and compact PCB area for dense system designs.
• Predictable Power Requirements: A narrow core voltage window (1.425 V to 1.575 V) simplifies power-supply design and margin planning.

Why Choose M1A3PE3000L-1FGG896M?

The M1A3PE3000L-1FGG896M positions itself as a high-capacity, qualified FPGA suitable for designers who require substantial logic resources, extensive I/O, and formal military qualification. Its combination of logic elements, embedded memory, and a wide operating temperature range supports demanding embedded and mission-critical applications.

Engineers and procurement teams looking for a Microchip Technology FPGA with defined supply rails, a compact 896-FBGA footprint, and MIL-STD-883 qualification will find this device appropriate for systems requiring long-term reliability and robust environmental performance.

Request a quote or submit an RFQ for M1A3PE3000L-1FGG896M to receive pricing and availability information tailored to your project needs.