M1A3PE3000L-1FG484I

The M1A3PE3000L-1FG484I is a ProASIC3L field programmable gate array (FPGA) in a 484-ball BGA package designed for industrial-grade embedded systems. It provides a combination of reconfigurable logic, on-chip memory, and a large I/O count for designs that require flexible hardware customization and durable operation across a wide temperature range.

With 75,264 logic elements, roughly 0.52 Mbits of embedded memory, and support for 341 I/O, this device targets applications that need significant gate count and I/O integration while operating from a low-voltage supply.

Key Features

• Core Logic 75,264 logic elements (LEs) delivering a total gate capacity of approximately 3,000,000 gates for implementing complex custom logic and state machines.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for data buffering, FIFOs, and small embedded storage needs.
• I/O Capacity 341 user I/O pins to support broad connectivity and peripheral interfacing in dense system designs.
• Power Operates from a core voltage supply range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting Supplied in a 484-ball FPBGA (23 × 23) package, ideal for surface-mount assembly in space-constrained boards.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments where wider temperature tolerance is required.
• Compliance RoHS compliant for use in designs requiring lead-free assembly and regulatory conformance.

Typical Applications

• Industrial Control Implement custom motor control logic, sensor aggregation, and industrial communication interfaces using the device's high logic count and extensive I/O.
• Embedded Systems Integrate protocol handling, glue logic, and peripheral controllers where on-chip RAM and reconfigurable logic reduce external component count.
• I/O Consolidation Concentrate multiple discrete interfaces into a single FPGA to simplify board layout and reduce BOM complexity.
• Prototyping and Custom Accelerators Use the reprogrammable fabric to prototype hardware functions or accelerate compute kernels within constrained power and package envelopes.

Unique Advantages

• High Logic Density: 75,264 logic elements and ~3,000,000 gates enable implementation of substantial custom logic without external ASIC development.
• On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports buffering and local data storage, reducing reliance on external memory for many tasks.
• Extensive I/O Count: 341 I/O pins provide flexibility to interface with multiple peripherals, sensors, and buses directly at the FPGA.
• Industrial Temperature Range: Operation from −40 °C to 100 °C helps ensure reliable performance in demanding ambient conditions.
• Surface-Mount BGA Packaging: The 484-FPBGA (23×23) package offers a compact, board-level solution for high-density designs.
• RoHS Compliance: Meets lead-free assembly requirements for regulated manufacturing environments.

Why Choose M1A3PE3000L-1FG484I?

The M1A3PE3000L-1FG484I balances substantial reconfigurable logic, embedded memory, and high I/O capacity in an industrial-grade FPGA package. Its specifications make it a viable option for engineers developing embedded and industrial applications that require programmable hardware, on-chip storage, and broad peripheral connectivity while operating across a wide temperature range.

This device suits development teams and production designs that value scalability and integration—reducing external components and enabling hardware customization without committing to fixed-function silicon.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the M1A3PE3000L-1FG484I. Our team can provide lead-time details and assist with volume requirements.