M1A3PE3000-PQG208I

The M1A3PE3000-PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic fabric in a 208-BFQFP package. It provides a large logic capacity, substantial embedded memory, and a broad I/O complement for demanding embedded designs.

Targeted at applications that require up to 3,000,000 gates, 75,264 logic elements and 147 I/O pins, this device delivers a balance of integration and deployment-ready specifications including surface-mount mounting, a defined supply voltage range, and an industrial operating temperature range.

Key Features

• Core Logic Up to 3,000,000 gates and 75,264 logic elements providing a high-density programmable fabric for complex logic implementations.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) to support data buffering, state storage and local memory functions.
• I/O Capability 147 user I/O pins suitable for interfacing to diverse peripherals and external logic.
• Power Defined supply voltage range of 1.425 V to 1.575 V for predictable power design and system integration.
• Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly flows.
• Industrial Temperature Range Rated for operation from −40°C to 100°C to meet elevated-environment deployment requirements.
• Regulatory Compliance RoHS compliant to support Restriction of Hazardous Substances requirements.

Typical Applications

• Industrial Control — The industrial-grade temperature range (−40°C to 100°C) and 147 I/O pins enable robust control interfaces and I/O consolidation in automation systems.
• High-density Logic Implementations — 75,264 logic elements and 3,000,000 gates support complex custom logic functions and protocol processing.
• Embedded System Integration — Approximately 0.516 Mbits of embedded memory combined with large logic capacity facilitates on-chip buffering and state machines for embedded designs.
• Compact PCB Designs — The 208-BFQFP surface-mount package (208-PQFP, 28×28) allows integration into space-constrained boards while providing extensive I/O.

Unique Advantages

• High Logic Density: 3,000,000 gates and 75,264 logic elements enable substantial on-chip implementation of custom digital functions, reducing the need for external ASICs or glue logic.
• Integrated On-chip Memory: Approximately 0.516 Mbits of embedded RAM supports local data storage and buffering, simplifying board-level memory requirements.
• Broad I/O Count: 147 I/Os provide flexibility for multiple peripheral interfaces and signal routing without extensive external multiplexing.
• Industrial Temperature Capability: Rated from −40°C to 100°C for deployment in environments with wide temperature fluctuations.
• Standard Surface-Mount Package: 208-BFQFP (supplier 208-PQFP, 28×28) supports mainstream PCB assembly processes and helps control BOM and mechanical integration.
• Regulatory Readiness: RoHS compliance supports environmentally conscious product designs and procurement requirements.

Why Choose M1A3PE3000-PQG208I?

The M1A3PE3000-PQG208I delivers a high-capacity ProASIC3E FPGA solution tailored for designs that demand extensive programmable logic, meaningful on-chip memory, and a large I/O footprint in a surface-mount BFQFP package. Its defined supply voltage range and industrial operating temperature rating make it suitable for robust embedded and industrial deployments where predictable electrical and thermal behavior is required.

This device is well suited for engineering teams seeking a single-device option to consolidate complex digital functions and local memory, reduce external component count, and maintain design flexibility through programmable logic elements.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3PE3000-PQG208I and discuss how it can meet your project requirements.