M1A3PE3000-FGG896I

The M1A3PE3000-FGG896I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology, offered in an 896-ball FBGA (31×31) surface-mount package. It delivers a large logic capacity and high I/O count in a single, industrial-grade device, suitable for designs that require reprogrammable logic with substantial on-chip resources.

Key programmable resources include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and support for up to 620 I/O pins. The device operates from a 1.425 V to 1.575 V supply and is specified for operation from -40 °C to 100 °C.

Key Features

• Core Logic  75,264 logic elements and a total gate count of 3,000,000 provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density  Up to 620 I/O pins enable high-density external connectivity and interface options on a single device.
• Power Supply  Operates from a 1.425 V to 1.575 V supply rail, matching low-voltage system environments.
• Package  896-FBGA (31×31) package case in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range  Rated for -40 °C to 100 °C operation, suitable for industrial deployments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in programmable logic and control systems that require wide operating temperature range and industrial-grade components.
• High-density I/O Systems  Integrate multiple external interfaces and sensors leveraging the device’s 620 I/O pins for dense connectivity.
• Memory‑assisted Logic  Embedded memory supports local buffering and small data stores for custom logic functions.

Unique Advantages

• Highly Integrated Solution: The combination of 75,264 logic elements and 3,000,000 gates reduces the need for external glue logic and simplifies board design.
• High I/O Count: 620 I/O pins enable complex interfacing without adding external multiplexers or expanders.
• Industrial-ready Temperature Range: Rated from -40 °C to 100 °C for reliable operation in challenging environments.
• Compact BGA Packaging: The 896-FBGA (31×31) package provides a compact footprint for space-constrained PCBs while supporting high pin count.
• Low-voltage Operation: Native operation between 1.425 V and 1.575 V aligns with modern low-voltage system domains.
• RoHS Compliant: Meets environmental directives for lead-free assembly and material compliance.

Why Choose M1A3PE3000-FGG896I?

The M1A3PE3000-FGG896I delivers a balance of large programmable logic capacity, substantial embedded memory, and very high I/O density in an industrial-grade FPGA package from Microchip Technology. Its combination of 75,264 logic elements, approximately 0.516 Mbits of on-chip RAM, and 620 I/Os makes it well suited for complex industrial, control, and high-connectivity designs that require robust temperature performance.

Engineers specifying this device can leverage its compact 896-FBGA package and low-voltage operation to integrate significant programmable resources while managing board space and power domains, with RoHS compliance for environmentally conscious assemblies.

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