M1A3PE3000-FGG484

The M1A3PE3000-FGG484 is a ProASIC3E family Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for programmable digital designs that require a commercial-grade, surface-mount FPGA solution.

Key Features

• Core Logic 75,264 logic elements providing a foundation for complex digital functions and custom logic implementation.
• Gate Count 3,000,000 gates to support medium-to-large scale digital designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and small data structures.
• I/O Capacity 341 user I/Os to support multiple interfaces and parallel connectivity requirements.
• Package & Mounting 484-BGA package (supplier device package: 484-FPBGA, 23×23) designed for surface-mount assembly in compact board layouts.
• Power Narrow core voltage supply range from 1.425 V to 1.575 V for predictable power provisioning.
• Operating Conditions Commercial temperature range of 0 °C to 85 °C and commercial-grade specification.
• Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Custom digital logic — Implement glue logic, protocol handling, and bespoke state machines using the device's 75,264 logic elements and on-chip RAM.
• Interface bridging and I/O expansion — Leverage 341 I/Os to connect multiple peripherals, buses, and external devices in a single FPGA.
• Prototyping and evaluation — Use the surface-mount 484-BGA package and commercial temperature rating for board-level development and proof-of-concept designs.

Unique Advantages

• High logic integration: 75,264 logic elements and 3,000,000 gates enable consolidation of multiple functions into a single device, reducing BOM count.
• On-chip memory for system functions: Approximately 0.516 Mbits of embedded RAM supports buffers and small data structures without external memory.
• Extensive I/O count: 341 user I/Os provide flexibility for multi-interface systems and parallel connectivity.
• Compact surface-mount package: 484-FPBGA (23×23) footprint enables dense PCB integration while maintaining a large pin count.
• Predictable power requirements: Defined core voltage range (1.425 V–1.575 V) simplifies power-supply design and validation.
• RoHS compliance: Supports lead-free manufacturing and assembly processes.

Why Choose M1A3PE3000-FGG484?

The M1A3PE3000-FGG484 positions itself as a commercial-grade FPGA offering a substantial mix of logic resources, embedded memory, and I/O capacity in a compact 484-BGA package. It is suited for designers needing to integrate multiple digital functions, interface with numerous peripherals, or consolidate board-level logic into a single programmable device.

With clearly defined electrical and thermal parameters—narrow core voltage range and a 0 °C to 85 °C operating window—this device offers predictable integration into commercial electronic systems while maintaining RoHS compliance for modern manufacturing requirements.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the M1A3PE3000-FGG484 ProASIC3E FPGA.