M1A3PE3000-FGG324I

The M1A3PE3000-FGG324I is a ProASIC3E field programmable gate array (FPGA) manufactured by Microchip Technology. It provides a large logic fabric and on-chip memory in a compact 324-BGA package for industrial embedded designs.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 221 I/O pins, this device targets industrial applications that require reconfigurable logic, high I/O density and reliable operation across a wide temperature range.

Key Features

• Logic Capacity – 75,264 logic elements supporting complex, programmable digital designs and custom logic implementations.
• Gate Count – Approximately 3,000,000 gates to accommodate sizeable combinational and sequential logic networks.
• Embedded Memory – Approximately 0.516 Mbits of on-chip RAM for buffering, state storage and small data tables.
• I/O – 221 general-purpose I/O pins to support a wide range of external interfaces and parallel connections.
• Power – Core supply voltage range of 1.425 V to 1.575 V for defined low-voltage operation.
• Package & Mounting – 324-BGA (supplier device package: 324-FBGA, 19×19) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance – RoHS compliant for alignment with lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control Systems – Implement custom control logic and I/O aggregation where industrial temperature range and high I/O count are required.
• Embedded Signal Processing – Use the device’s logic capacity and on-chip RAM for tailored digital signal processing pipelines and buffering.
• Custom Interface Bridging – Bridge and translate between multiple parallel or peripheral interfaces using abundant I/O and programmable logic.
• OEM and Product Integration – Integrate programmable functionality into industrial equipment and embedded products that require reprogrammability and a compact BGA footprint.

Unique Advantages

• High logic density: 75,264 logic elements and roughly 3,000,000 gates provide the capacity to implement complex custom logic without external ASICs.
• Significant on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces the need for discrete memory in many buffering and state-storage use cases.
• Large I/O complement: 221 I/O pins enable direct connection to numerous peripherals and parallel interfaces, simplifying board design.
• Industrial-rated operation: Rated for −40 °C to 100 °C, suitable for rugged and temperature-variable installations.
• Compact BGA package: 324-BGA (324-FBGA, 19×19) surface-mount package saves board space while supporting high pin counts.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing requirements.

Why Choose M1A3PE3000-FGG324I?

The M1A3PE3000-FGG324I balances substantial programmable logic, embedded memory and a high I/O count in a compact industrial-grade BGA package. It is well suited for engineers and OEMs building industrial and embedded systems that require flexible, reconfigurable hardware with reliable temperature performance.

Backed by Microchip Technology, this FPGA provides a scalable platform for integrating custom digital functions, reducing component count and enabling in-field updates while meeting RoHS requirements and industrial temperature demands.

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