M1A3PE3000-FG896I

The M1A3PE3000-FG896I is a ProASIC3E field programmable gate array (FPGA) device offered in an 896-ball BGA package. It provides a high logic capacity with integrated on-chip memory and a substantial I/O count for dense, compact designs.

Designed for industrial-grade applications, the device combines approximately 3,000,000 gates, 75,264 logic elements and approximately 0.516 Mbits of embedded memory, while supporting a 1.425 V to 1.575 V core supply and an operating temperature range of −40°C to 100°C.

Key Features

• Logic Capacity  75,264 logic elements and approximately 3,000,000 gates provide extensive programmable fabric for complex logic integration.
• On‑Chip Memory  Approximately 0.516 Mbits of embedded memory for buffering, state storage or simple memory-mapped functions.
• I/O Density  620 available I/O pins enable wide peripheral connectivity and high-pin-count interfaces in a single device.
• Package and Mounting  896-BGA package (supplier package: 896-FBGA, 31×31) in a surface-mount form factor suited for space-constrained PCBs.
• Power  Core supply range of 1.425 V to 1.575 V to match system power domains and regulator designs.
• Temperature Range & Grade  Industrial grade device specified for operation from −40°C to 100°C.
• Compliance  RoHS compliant.

Unique Advantages

• High logic density: Enables consolidation of multiple functions into a single programmable device, reducing board-level component count.
• Large I/O count: 620 I/O pins simplify integration of high-pin-count interfaces without external multiplexing.
• Embedded memory: Approximately 0.516 Mbits of on-chip RAM support local buffering and state retention to improve system responsiveness.
• Industrial temperature capability: Operation from −40°C to 100°C supports deployment in industrial environments.
• Compact BGA footprint: 896-ball FBGA (31×31) package allows dense placement and reliable solder joint geometry for production assemblies.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing.

Why Choose M1A3PE3000-FG896I?

The M1A3PE3000-FG896I positions itself as a high-capacity, industrial-grade FPGA option that brings together substantial logic resources, on-chip memory and a very high I/O count in a compact 896-BGA package. Its core supply window and broad operating temperature range make it suitable for designs that require robust, long-life deployments.

This device is well suited for engineering teams needing to consolidate complex digital functions into a single programmable device while maintaining a compact PCB footprint and adherence to RoHS requirements. Its specification set supports scalability across demanding industrial applications where logic density, I/O availability and thermal robustness are key design considerations.

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