M1A3PE3000-FG484

The M1A3PE3000-FG484 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology supplied in a 484-ball BGA package. It provides a high-density programmable fabric with 3,000,000 gates and 75,264 logic elements, combined with on‑chip embedded memory and a large I/O count for complex digital integration.

Designed as a commercial‑grade, surface‑mount device, the M1A3PE3000-FG484 operates from a core voltage range of 1.425 V to 1.575 V and across an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic Density 3,000,000 gates and 75,264 logic elements provide capacity for complex custom logic implementations and large-scale combinational/sequential designs.
• Embedded Memory Approximately 0.516 Mbits of on‑chip RAM (516,096 bits) for buffering, state storage, and fast local memory access.
• I/O Capacity 341 user I/O pins support extensive interface and peripheral connectivity for systems requiring broad external signal integration.
• Power and Supply Core supply requirement of 1.425 V to 1.575 V to match system power rails and planning for power delivery.
• Package & Mounting 484-ball FPBGA (23 × 23) package in a surface‑mount format (Package Case: 484‑BGA; Supplier Device Package: 484‑FPBGA) for compact board-level integration.
• Operating Conditions & Grade Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental conformity.

Typical Applications

• Custom digital logic — Implement complex control, data-path, or protocol logic leveraging up to 3,000,000 gates and 75,264 logic elements.
• High‑density I/O interfacing — Drive multiple external interfaces and peripherals using the 341 user I/O pins.
• On‑chip buffering and state storage — Use approximately 0.516 Mbits of embedded RAM for temporary data buffering, FIFOs, and state machines.

Unique Advantages

• High logic capacity: 3,000,000 gates and 75,264 logic elements allow consolidation of multiple discrete functions into a single programmable device, reducing board-level component count.
• Substantial embedded memory: Approximately 0.516 Mbits of on‑chip RAM supports local data storage and reduces the need for external memory in many designs.
• Extensive I/O support: 341 I/O pins enable broad peripheral and interface connectivity without additional I/O expanders.
• Compact BGA footprint: 484‑FPBGA (23 × 23) packaging delivers high pin density in a surface‑mount form factor for space-constrained boards.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet typical commercial and industrial-adjacent applications requiring that range.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations in product design.

Why Choose M1A3PE3000-FG484?

The M1A3PE3000-FG484 combines high logic density, a sizeable on‑chip memory resource, and a large number of I/O pins in a compact 484‑ball FPBGA package, making it well suited for designs that require integration of complex digital functions and multiple external interfaces. Its commercial temperature range, surface‑mount packaging, and RoHS compliance make it practical for mainstream embedded applications where consolidation and board real‑estate savings are priorities.

For engineering teams targeting solutions that demand substantial programmable logic, ample embedded RAM, and broad I/O capability in a single device, the M1A3PE3000-FG484 offers a balanced option with clear, verifiable specifications to support system planning and BOM decisions.

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