M1A3PE3000-FG324

The M1A3PE3000-FG324 is a ProASIC3E Field Programmable Gate Array (FPGA) offered in a 324-ball BGA package. It provides a high logic element count and substantial on-chip memory for implementing complex programmable logic functions.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 221 I/O pins, this device is suited to designs that require a balance of logic capacity, I/O density, and compact packaging while operating within a standard commercial temperature range.

Key Features

• Core & Logic  Contains 75,264 logic elements and approximately 3,000,000 gates for implementing complex digital functions and state machines.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM to support buffering, small FIFOs, and local data storage.
• I/O & Connectivity  221 user I/O pins enable dense peripheral and bus interfacing in a single device.
• Power  Nominal supply voltage specified from 1.425 V to 1.575 V for core power planning and regulator selection.
• Package & Mounting  324-ball FBGA (19 × 19) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing conformity.

Typical Applications

• Custom digital control  Implements application-specific control logic using 75,264 logic elements to realize complex finite-state machines and control paths.
• High-density I/O interfacing  Provides 221 I/Os for connecting multiple peripherals, buses, or front-end interfaces on compact PCBs.
• Embedded system integration  Combines logic, memory, and I/O in a single device to reduce board-level component count in embedded designs.
• Signal processing and data handling  Uses the device’s logic capacity and on-chip RAM for localized processing, buffering, and glue logic tasks.

Unique Advantages

• High logic capacity: 75,264 logic elements and roughly 3,000,000 gates enable implementation of substantial digital functions on a single FPGA.
• Meaningful on-chip memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and small data structures without external memory.
• Extensive I/O: 221 I/O pins allow flexible connectivity to peripherals, sensors, and external interfaces while minimizing additional interface components.
• Compact BGA packaging: 324-FBGA (19 × 19) provides a dense footprint for space-constrained board designs and surface-mount assembly.
• Defined power envelope: Core supply specified at 1.425 V–1.575 V simplifies power-supply selection and thermal planning.
• Commercial temperature rating: Rated 0 °C–85 °C to match standard commercial applications and environments.

Why Choose M1A3PE3000-FG324?

The M1A3PE3000-FG324 positions itself as a high-capacity, compact FPGA option for designers who need substantial programmable logic, meaningful on-chip memory, and a large I/O complement in a surface-mount BGA package. Its specified core voltage range and commercial temperature rating make it straightforward to plan power and thermal design for typical embedded applications.

This device suits projects that require integration of multiple digital functions onto a single chip—reducing BOM complexity and board space—while maintaining a verifiable specification set for procurement and system design.

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