M1A3PE3000-2PQ208

The M1A3PE3000-2PQ208 is a ProASIC3E field programmable gate array (FPGA) in a 208‑lead BFQFP package designed for commercial applications. Built with a high logic capacity and embedded memory, it targets designs that require substantial programmable logic, on-chip RAM, and a moderate I/O count while operating within commercial temperature and voltage ranges.

Key Features

• Core Logic 75,264 logic elements (cells) and approximately 3,000,000 gates provide substantial capacity for complex programmable logic implementations.
• Embedded Memory Approximately 0.516 Mbits of on‑chip RAM supports data buffering, state storage, and small lookup tables directly in the FPGA fabric.
• I/O Capability 147 user I/O pins to interface with sensors, peripherals, buses, and external devices.
• Power Operates from a core voltage supply range of 1.425 V to 1.575 V, enabling controlled power design and integration with system rails.
• Package & Mounting 208‑lead BFQFP package (supplier device package: 208‑PQFP, 28×28) in a surface‑mount form factor for PCB-level integration.
• Thermal & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for restriction of hazardous substances in the component.

Typical Applications

• Embedded System Control Implement custom control logic, state machines, and peripheral bridging using the device's high logic element count and on‑chip RAM.
• Communications Interfaces Use the 147 I/O pins to connect protocol converters, transceivers, and interface logic for networking or serial communications.
• Consumer and Industrial Electronics Integrate user interfaces, sensor aggregation, and system glue logic where commercial temperature range and surface‑mount packaging are suitable.
• Prototyping and Development Deploy for evaluation and design iteration when significant programmable logic and embedded memory are required on a single device.

Unique Advantages

• High Logic Capacity: 75,264 logic elements and 3,000,000 gates enable implementation of complex digital functions without external logic proliferation.
• On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small buffering and lookup needs.
• Generous I/O Count: 147 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
• Compact Surface‑Mount Package: 208‑lead BFQFP (208‑PQFP, 28×28) enables dense PCB integration while maintaining a standard package footprint.
• Controlled Power Envelope: Narrow core supply range (1.425–1.575 V) simplifies power sequencing and regulator selection for stable operation.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturability requirements.

Why Choose M1A3PE3000-2PQ208?

The M1A3PE3000-2PQ208 delivers a balanced combination of sizeable programmable logic, embedded memory, and ample I/O in a commercial‑grade, surface‑mount package. It is well suited for engineers and procurement teams seeking a single‑chip solution to consolidate digital logic, interface functions, and on‑chip storage while operating within a 0 °C to 85 °C thermal range.

This device is ideal for mid- to high‑complexity designs where on‑board integration, predictable power requirements, and RoHS compliance matter. Its specification set supports scalable designs and streamlines BOMs by reducing the need for external glue logic and small memory components.

If you would like a quote or more information about availability and pricing for M1A3PE3000-2PQ208, submit a request or inquiry and our team will respond with details tailored to your project needs.