M1A3PE3000-2FGG484I

The M1A3PE3000-2FGG484I is a ProASIC3E family field programmable gate array (FPGA) supplied in a 484-ball fine-pitch BGA package. It delivers a large logic fabric with integrated on-chip RAM and a high I/O count suitable for industrial-class embedded designs.

Designed for use in industrial environments, this device combines approximately 75,264 logic elements and roughly 3,000,000 gates with 341 I/Os, offering a balance of integration and I/O density for system-level functions that require moderate embedded memory and high pin count.

Key Features

• Logic Capacity  Approximately 75,264 logic elements (cells) providing about 3,000,000 gates for implementation of complex logic, glue logic, and custom processing blocks.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) to support buffering, state storage, and small data structures directly on the FPGA.
• I/O and Package  High I/O count with 341 user I/Os in a 484-FPBGA (23×23) package; surface-mount mounting type suited for dense board designs.
• Power Supply Range  Core supply voltage range of 1.425 V to 1.575 V for defined power planning and system integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet temperature requirements common in industrial deployments.
• Regulatory Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use in control systems that need a robust logic fabric and wide operating temperature range for reliable operation in factory and process environments.
• Embedded Systems  Integration of custom data paths, bus interfaces, and system glue logic leveraging the device’s large logic capacity and on-chip RAM.
• High-Density I/O Designs  Applications requiring many external connections can take advantage of the 341 I/Os and compact 484‑BGA package to conserve PCB space.
• Communications and Networking Modules  Implement protocol handling, buffering, or parallel processing functions using on-chip memory and extensive logic resources.

Unique Advantages

• High Logic Integration: The combination of ~75,264 logic elements and ~3,000,000 gates enables consolidation of multiple functions into a single FPGA, reducing overall component count.
• Substantial Embedded RAM: Approximately 0.52 Mbits of on-chip RAM lets designers keep critical buffers and state machines local to the FPGA fabric, simplifying memory architecture.
• Large I/O Count in Compact Package: 341 I/Os in a 484‑ball FPBGA (23×23) package provides excellent pin density for systems with extensive external interfacing while minimizing board area.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support deployments in harsher thermal environments common in industrial applications.
• Defined Supply Window: A clear core voltage range (1.425 V–1.575 V) aids in predictable power design and system integration.
• RoHS Compliant: Meets RoHS requirements to support modern manufacturing and environmental standards.

Why Choose M1A3PE3000-2FGG484I?

The M1A3PE3000-2FGG484I positions itself as a robust FPGA option for designers who need substantial logic capacity, meaningful on-chip RAM, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded and industrial applications where environmental range and regulatory compliance are required.

This device is a fit for engineers consolidating multiple functions into a single programmable device—offering integration, predictable power characteristics, and I/O density for mid- to high-pin-count systems while enabling streamlined board layouts.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the M1A3PE3000-2FGG484I.