M1A3PE3000-2FGG324I

The M1A3PE3000-2FGG324I is a ProASIC3E flash-based FPGA from Microchip Technology designed for I/O-heavy, embedded logic applications. It delivers a high-density fabric with 75,264 logic elements and 3,000,000 gates in a compact 324-BGA footprint.

With approximately 0.516 Mbits of embedded RAM, 221 user I/Os, a narrow core supply range, and an industrial operating temperature range, this device targets robust, space-constrained designs that require significant on-chip logic and memory in a surface-mount BGA package.

Key Features

• Logic Capacity  75,264 logic elements providing a total of 3,000,000 gates for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, FIFOs, and small data structures without external memory.
• I/O Density  221 user I/Os suitable for designs requiring numerous external interfaces and peripheral connections.
• Power Supply  Core supply range from 1.425 V to 1.575 V to match system power-rail constraints and enable predictable core operation.
• Package & Mounting  324-BGA package (supplier device package: 324-FBGA 19×19) in a surface-mount form factor for compact board layouts.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Industrial Control  Implement control logic, interface bridging, and custom sequencing with high I/O counts and industrial temperature capability.
• Embedded Processing  Offload deterministic processing tasks and implement custom hardware accelerators using abundant logic elements and on-chip RAM.
• Interface Concentration  Aggregate and translate multiple peripheral interfaces where large numbers of I/Os and flexible logic routing are required.

Unique Advantages

• High-density logic in a compact package: 75,264 logic elements and 3,000,000 gates deliver significant integration in a 324-BGA footprint to reduce board area.
• Substantial on-chip RAM: Approximately 0.516 Mbits of embedded memory supports local buffering and control-state storage without extra components.
• Ample external connectivity: 221 I/Os allow complex system interconnects and flexible peripheral integration, simplifying PCB routing and system partitioning.
• Industrial temperature rating: Operation from −40 °C to 100 °C provides reliability across a wide range of deployment environments.
• RoHS compliant: Compatible with lead-free manufacturing and current environmental standards.

Why Choose M1A3PE3000-2FGG324I?

The M1A3PE3000-2FGG324I positions itself as a high-density, industrial-grade FPGA option when designers need a balance of logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded RAM, and 221 I/Os makes it well suited to embedded systems, interface-heavy designs, and industrial control applications that demand robust temperature performance.

For teams focused on reducing board-level complexity while maintaining scalability and reliability, this ProASIC3E device offers a practical integration point with a predictable core supply range and surface-mount BGA packaging compatible with standard PCB assembly processes.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000-2FGG324I. Our team can assist with lead times and ordering details tailored to your project needs.