M1A3PE3000-2FGG484

The M1A3PE3000-2FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density logic fabric with substantial on-chip memory and a large I/O complement in a compact 484-ball BGA package.

Designed for commercial-grade electronic designs, the device combines 75,264 logic elements with approximately 0.516 Mbits of embedded RAM, making it suitable for applications that require significant programmable logic, multiple external interfaces, and a controlled commercial temperature range.

Key Features

• Logic Capacity — 75,264 logic elements (cells) supporting up to 3,000,000 gates for complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM to store state, buffers, and small data structures without external memory.
• I/O Density — 341 I/O pins to accommodate multiple external interfaces and peripheral connections.
• Package and Mounting — 484-ball FPBGA (23 × 23) package in a 484-BGA footprint with surface-mount mounting for compact board designs.
• Power — Core voltage supply range of 1.425 V to 1.575 V for defined power budgeting and supply-domain design.
• Temperature Range — Commercial operating range from 0 °C to 85 °C for standard commercial-environment deployments.
• Compliance — RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement custom control logic and interface glue in commercial electronics using the device's 75,264 logic elements and 341 I/Os.
• High-density I/O designs — Support multiple external peripherals and interfaces with a large I/O count in a compact BGA package.
• On-chip memory-dependent logic — Use approximately 0.516 Mbits of embedded RAM for buffering, state machines, and small data storage without relying on external memory.

Unique Advantages

• High logic density: 75,264 logic elements enable implementation of complex functions and sizable gate counts within a single FPGA device.
• Substantial on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Large I/O complement: 341 I/Os simplify integration with multiple peripherals, sensors, and interfaces on compact PCBs.
• Compact BGA package: 484-ball FPBGA (23 × 23) allows high pin count in a space-efficient surface-mount form factor.
• Commercial temperature and RoHS compliance: Designed for commercial-temperature operation (0 °C to 85 °C) and RoHS-compliant manufacturing requirements.

Why Choose M1A3PE3000-2FGG484?

The M1A3PE3000-2FGG484 positions itself as a commercially graded FPGA that balances high logic capacity, on-chip memory, and a large I/O count in a compact 484-BGA package. It is suitable for designers who need significant programmable logic and interface density within standard commercial environmental limits.

As a Microchip Technology offering, this device provides a clear specification set—including core voltage range, operating temperature, and RoHS status—useful for procurement and system-level power and thermal planning in commercial electronic designs.

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