M1A3PE3000-2PQ208I

The M1A3PE3000-2PQ208I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 208-pin BFQFP package. It provides a substantial logic fabric and on-chip memory suitable for industrial embedded designs that require configurable digital logic within a robust temperature range.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 147 I/Os, this device targets applications that need moderate-to-high logic capacity, abundant I/O, and deterministic hardware configurability while operating across industrial temperature limits.

Key Features

• Logic Capacity 75,264 logic elements and 3,000,000 gates provide a large programmable fabric for implementing custom digital functions and complex logic.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing without external memory for many designs.
• High I/O Count 147 user I/Os to support dense peripheral interfacing, parallel buses, and multi-channel I/O requirements.
• Power Supply Range Operates from 1.425 V to 1.575 V, enabling predictable power planning and supply selection for the target system.
• Industrial Temperature Rating Specified for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
• Package and Mounting Available in a 208-pin BFQFP (supplier device package listed as 208-PQFP, 28×28) and designed for surface-mount assembly.
• Compliance RoHS compliant for regulatory and environmental alignment in product designs.

Typical Applications

• Industrial Control and Automation Combines high logic capacity and wide operating temperature range to implement custom control logic, I/O aggregation, and timing-critical functions in industrial systems.
• Communications and Networking Equipment 147 I/Os and significant gate count enable protocol bridging, parallel interfacing, and custom packet processing in communications modules.
• Instrumentation and Test On-chip RAM and abundant logic elements support real-time data capture, signal conditioning logic, and custom measurement preprocessing.
• Custom Embedded Systems Suitable for application-specific accelerators, glue logic, and interface adaptation where configurable hardware reduces board-level complexity.

Unique Advantages

• High Logic Density: 75,264 logic elements deliver capacity for substantial custom logic implementations without external ASIC development.
• Integrated On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Generous I/O Resources: 147 I/Os simplify integration with sensors, peripherals, and bus interfaces, lowering the need for external multiplexers or expanders.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Surface-Mount 208-Pin Package: Compact 208-BFQFP / 208-PQFP (28×28) package enables high-density PCB layouts while supporting automated assembly.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental requirements for commercial and industrial products.

Why Choose M1A3PE3000-2PQ208I?

The M1A3PE3000-2PQ208I positions itself as a capable, industrial-grade FPGA option when your design requires a combination of high logic density, substantial on-chip RAM, and plentiful I/O in a surface-mount 208-pin package. Its electrical and thermal specifications support integration into industrial embedded systems where reliable, configurable hardware is needed.

Designed and manufactured by Microchip Technology, this ProASIC3E device offers a balance of capacity and robustness for engineers building control systems, communications modules, instrumentation, and other embedded applications that benefit from programmable logic. Its specification set supports long-term deployment scenarios that require consistent operating behavior across a broad temperature range.

Request a quote or submit an inquiry for the M1A3PE3000-2PQ208I to discuss pricing, availability, and integration guidance for your next design.