M1A3PE3000-FGG484I

The M1A3PE3000-FGG484I is a ProASIC3E Field Programmable Gate Array from Microchip Technology designed for industrial applications that require reconfigurable logic and high I/O density. The device combines 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 341 I/Os in a compact 484-ball BGA footprint.

With a specified operating range from -40 °C to 100 °C and a core voltage window of 1.425 V to 1.575 V, this surface-mount FPGA targets systems that demand robust thermal performance, substantial gate capacity (3,000,000 gates), and a high pin count for complex interfacing.

Key Features

• Core Capacity  75,264 logic elements and 3,000,000 gates provide substantial programmable logic resources for medium- to high-complexity designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, state storage, and small data tables within the FPGA fabric.
• I/O Density  341 general-purpose I/Os suitable for multi-channel interfacing, parallel buses, and mixed-signal companion devices.
• Power Supply  Core voltage specified at 1.425 V to 1.575 V to support predictable power-supply planning and stable logic operation.
• Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for systems exposed to extended temperature ranges.
• Environmental Compliance  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Industrial Automation  Implements custom control logic, gate-level sequencing, and I/O aggregation in factory equipment and motion-control systems operating across wide temperatures.
• Communications & Networking  Handles protocol bridging, parallel interface aggregation, and glue-logic tasks where high I/O count and reconfigurability are required.
• Instrumentation & Test  Provides programmable timing, data capture buffering, and interface adaptation for laboratory instruments and automated test equipment.
• Embedded Systems  Serves as a central programmable logic device for systems requiring substantial gate count and embedded RAM for local data handling.

Unique Advantages

• High Logic Density:  75,264 logic elements and 3,000,000 gates enable implementation of complex logic functions without external CPLDs or discrete glue logic.
• Substantial I/O Capability:  341 I/Os reduce the need for external expanders when interfacing multiple peripherals or buses.
• Embedded Memory:  Approximately 0.52 Mbits of on-chip RAM supports local buffering and state storage, simplifying board-level memory requirements.
• Industrial Temperature Rating:  Operation from -40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact BGA Footprint:  484-ball FPBGA (23 × 23) enables high-density board layouts while maintaining a surface-mount assembly process.
• RoHS Compliant:  Meets lead-free manufacturing standards for environmentally conscious designs.

Why Choose M1A3PE3000-FGG484I?

The M1A3PE3000-FGG484I positions itself as a robust, industrial-grade FPGA option for designs that need substantial programmable logic, a high number of I/Os, and on-chip memory in a compact package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded RAM, and 341 I/Os makes it well suited to mid- to high-density embedded applications where board area and thermal tolerance matter.

Engineers and procurement teams will find long-term value in the device’s predictable voltage supply window, industrial temperature rating, and RoHS compliance for manufacturing and deployment in demanding environments.

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