M1A3PE3000L-1FG896I

The M1A3PE3000L-1FG896I is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density programmable fabric with 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and up to 620 general-purpose I/O pins, packaged in an 896-ball BGA.

Designed for industrial-grade applications, the device combines significant logic capacity and I/O density with a broad operating voltage range and extended temperature tolerance to address complex digital integration needs where robustness and integration matter.

Key Features

• Core Logic 
  75,264 logic elements supporting up to 3,000,000 gates, enabling substantial on-chip combinational and sequential logic implementation.
• Embedded Memory 
  Approximately 0.52 Mbits of on-chip RAM for compact buffering, state storage, and data processing functions.
• I/O Capacity 
  620 I/O pins to support dense external interfacing, making it suitable for designs requiring numerous parallel or multiplexed connections.
• Power Supply 
  Operates across a VCC range of 1.14 V to 1.575 V for compatibility with low-voltage system domains.
• Package 
  896-ball FBGA in a 31 × 31 mm footprint (896-BGA), offering a compact, high-pin-count surface-mount solution.
• Temperature Range 
  Industrial operating range from −40 °C to 100 °C for use in harsh or temperature-variable environments.
• Mounting 
  Surface-mount package for standard PCB assembly processes.
• Compliance 
  RoHS compliant.

Typical Applications

• Industrial Control Systems 
  Use the device’s logic capacity and extended temperature range to implement control algorithms, I/O aggregation, and deterministic processing in industrial environments.
• High-Density I/O Interfaces 
  Leverage 620 I/Os to consolidate multiple parallel interfaces or to implement complex bus bridging and signal routing on a single FPGA.
• Custom Digital Processing 
  Employ the abundant logic elements and on-chip RAM for bespoke data-paths, state machines, and protocol processing where integration reduces board-level complexity.

Unique Advantages

• High Integration Density: The combination of 75,264 logic elements and 3,000,000 gates enables large, complex designs to be implemented on a single device, reducing board-level BOM.
• Extensive I/O Count: 620 I/O pins provide flexibility for connecting multiple peripherals, sensors, or external devices without requiring external multiplexers.
• Compact High-Pin Package: The 896-FBGA (31 × 31 mm) package offers a high pin count in a compact surface-mount form factor suitable for space-constrained PCBs.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C to support deployment in temperature-variable industrial settings.
• Low-Voltage Operation: Support for 1.14 V to 1.575 V supply rails aligns with modern low-voltage digital domains and power-optimization strategies.
• RoHS Compliance: Environmentally compliant manufacturing status for global production requirements.

Why Choose M1A3PE3000L-1FG896I?

The M1A3PE3000L-1FG896I positions itself as a robust, high-density FPGA option for industrial designs that require a balance of logic capacity, large I/O count, and compact packaging. Its combination of 75,264 logic elements, substantial gate count, and on-chip memory supports complex digital functions while reducing system-level component count.

Engineers and procurement teams seeking a surface-mount, RoHS-compliant FPGA with extended temperature capability and flexible voltage operation will find this device suitable for scalable, integrated digital solutions where integration, I/O density, and environmental tolerance are priorities.

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