M1A3PE3000L-FGG484M

The M1A3PE3000L-FGG484M is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, provided in a 484-BGA (23×23) surface-mount package. It combines a high logic density with on-chip embedded memory and a large I/O complement for complex, high-reliability designs.

Qualified to MIL-STD-883 and rated as Military grade, this device is specified for operation from -55 °C to 125 °C and a core supply range of 1.425 V to 1.575 V, addressing applications that require rugged environmental performance and traceable qualification.

Key Features

• Logic Capacity  Approximately 75,264 logic elements (CLBs) providing around 3,000,000 gates for implementing complex digital functions.
• Embedded Memory  516,096 total RAM bits, approximately 0.52 Mbits of on-chip memory for buffering, state storage, and local data processing.
• I/O Resources  341 user I/O pins to support multiple external interfaces and parallel connectivity requirements.
• Package and Mounting  484-ball FPBGA (23×23) surface-mount package offering a compact footprint for board-level integration.
• Power Supply  Core voltage specified from 1.425 V to 1.575 V to match precise power-domain requirements.
• Temperature and Qualification  Operating range −55 °C to 125 °C and qualification to MIL-STD-883, suitable for military-grade applications.
• Compliance  RoHS compliant.

Typical Applications

• Military and defense electronics  Device qualification to MIL-STD-883 and Military grade classification make this FPGA suitable for defense systems requiring qualified components.
• High-density logic systems  Large logic element count and 3,000,000 gates support complex state machines, protocol processing, and custom logic implementations.
• Embedded memory and buffering  Approximately 0.52 Mbits of on-chip RAM enable localized data storage for real-time processing and buffering tasks.
• Complex I/O interfacing  341 I/O pins accommodate multi-channel sensor interfaces, control buses, and peripheral connectivity in compact designs.

Unique Advantages

• Military-qualified reliability: Qualification to MIL-STD-883 provides documented testability and traceability for high-reliability programs.
• Wide operating temperature range: −55 °C to 125 °C rating supports operation in extreme thermal environments common to defense applications.
• High integration density: 75,264 logic elements and 3,000,000 gates enable consolidation of multiple functions into a single FPGA, reducing BOM complexity.
• Substantial embedded memory: Approximately 0.52 Mbits of on-chip RAM reduces dependence on external memory for many embedded tasks.
• Large I/O complement: 341 I/Os offer flexibility for interfacing a variety of peripherals and parallel systems without extensive external glue logic.
• Compact BGA footprint: 484-FPBGA (23×23) package delivers high pin-count in a board-space-efficient form factor suitable for dense PCBs.

Why Choose M1A3PE3000L-FGG484M?

The M1A3PE3000L-FGG484M positions itself as a high-density, military-qualified FPGA option from Microchip Technology, combining significant logic resources, embedded RAM, and a large I/O count in a compact BGA package. Its MIL-STD-883 qualification, wide operating temperature range, and RoHS compliance make it well suited for programs where component qualification and environmental performance are critical.

This device is appropriate for design teams building rugged, high-reliability systems that require on-chip memory and substantial logic/I/O integration while maintaining a controlled core voltage domain and surface-mount packaging for modern PCB assemblies.

Request a quote or submit an inquiry for pricing and availability of the M1A3PE3000L-FGG484M to begin your sourcing or design evaluation.