M1A3PE3000L-PQ208

The M1A3PE3000L-PQ208 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It offers a high-density logic fabric with integrated on-chip memory and a substantial I/O count in a 208-BFQFP surface-mount package.

Designed for commercial applications, this device combines 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 147 I/O pins to support complex custom digital designs within a core supply range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 75,264 logic elements (equivalent to 3,000,000 gates) for implementing complex combinational and sequential logic structures.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and local data manipulation.
• I/O Resources 147 general-purpose I/O pins to support multiple external interfaces and parallel connections.
• Power and Voltage Core supply support from 1.14 V to 1.575 V to match low-voltage system requirements.
• Package and Mounting 208-BFQFP (supplier package: 208-PQFP, 28×28) surface-mount package for standardized PCB assembly.
• Commercial Grade and Temperature Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance Environmentally compliant (RoHS) for global electronics manufacturing requirements.

Typical Applications

• High-density custom logic Implement complex digital functions and state machines using the device's 75,264 logic elements and 3,000,000-gate equivalent capacity.
• I/O-intensive interfacing Use the 147 I/O pins for multi-channel sensor interfaces, parallel buses, or protocol bridging in embedded systems.
• On-chip buffering and local memory Leverage approximately 0.516 Mbits of embedded RAM for packet buffering, FIFOs, or temporary data storage within logic flows.
• Low-voltage FPGA designs Integrate into systems with core supply needs within 1.14 V to 1.575 V to maintain compatibility with low-voltage domains.

Unique Advantages

• High logic density: 75,264 logic elements provide substantial capacity for complex implementations without external glue logic.
• Integrated memory: Approximately 0.516 Mbits of on-chip RAM reduces the need for external memory in many buffering and state-retention tasks.
• Generous I/O count: 147 I/Os enable broad connectivity options and flexible pin assignments for diverse interface requirements.
• Package versatility: The 208-BFQFP (208-PQFP, 28×28) surface-mount package balances board density and manufacturability.
• Commercial operating range: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose M1A3PE3000L-PQ208?

The M1A3PE3000L-PQ208 delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a standardized 208-pin package, making it a practical choice for designers implementing complex digital designs within commercial temperature ranges. Its specified core voltage range and RoHS compliance help ensure compatibility with low-voltage systems and modern manufacturing requirements.

This device is suited for engineering teams seeking a high-density FPGA solution from Microchip Technology that consolidates logic, local memory, and plentiful I/O in a single, surface-mount package for streamlined board-level integration.

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