M1A3PE3000L-PQG208I

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

Quantity 1,472 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000L-PQG208I – ProASIC3L FPGA, 208-BFQFP

The M1A3PE3000L-PQG208I is a ProASIC3L field programmable gate array (FPGA) IC designed for industrial-grade embedded logic applications. It delivers a combination of high logic density, on-chip memory, and a substantial number of I/O in a 208-BFQFP surface-mount package.

Key differentiators include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 147 I/Os, low-voltage operation from 1.14 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C—features that support robust, low-voltage industrial designs.

Key Features

  • Core Density  75,264 logic elements provide significant programmable logic capacity for complex custom digital designs.
  • Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
  • Logic Gates  About 3,000,000 gates of implementation capacity for a broad range of logic functions and data-path designs.
  • I/O Capacity  147 available I/Os to support multiple interfaces, peripherals, and board-level connectivity requirements.
  • Power and Voltage  Supports low-voltage operation from 1.14 V to 1.575 V, enabling integration into modern low-voltage systems.
  • Package and Mounting  208-BFQFP (supplier 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly processes.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
  • Regulatory Compliance  RoHS compliant.

Unique Advantages

  • High logic integration: 75,264 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM complexity.
  • Embedded memory on-chip: Approximately 0.516 Mbits of RAM helps minimize external memory needs and simplifies board routing.
  • Extensive I/O count: 147 I/Os support flexible interfacing options for diverse peripheral sets and multi-channel designs.
  • Low-voltage compatibility: 1.14 V to 1.575 V supply range enables use in modern low-power systems and helps align with contemporary power rails.
  • Industrial-grade robustness: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
  • Standard surface-mount package: 208-BFQFP package supports established manufacturing processes for reliable assembly.

Why Choose M1A3PE3000L-PQG208I?

The M1A3PE3000L-PQG208I positions itself as a robust FPGA option for industrial applications that require a balance of high logic capacity, on-chip memory, and abundant I/O in a low-voltage, surface-mount package. Its specifications make it suitable for designers who need to consolidate functions onto a single programmable device while maintaining industrial temperature tolerance and RoHS compliance.

Choose this device when your project demands substantial programmable logic, embedded RAM, and flexible I/O in a proven package format—delivering integration and reliability that support scalable development and production deployments.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the M1A3PE3000L-PQG208I.

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