M1AFS1500-1FG484

The M1AFS1500-1FG484 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded logic applications. It delivers a balance of programmable logic, on-chip memory, and high I/O density in a compact 484-ball FBGA package.

With 1,500,000 gates, 38,400 logic elements, and 223 user I/O, this device targets designs that need substantial programmable fabric, significant I/O connectivity, and low-profile surface-mount packaging for space-constrained systems.

Key Features

• Core Logic  Approximately 1,500,000 gates implemented across 38,400 logic elements to implement complex combinational and sequential logic.
• On-Chip Memory  Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) for local buffering, FIFOs, and small lookup tables.
• I/O Capacity  223 user I/O pins provide broad connectivity for external peripherals, buses, and interface logic.
• Power  Specified operating supply range of 1.425 V to 1.575 V for the core supply requirement.
• Package and Mounting  484-ball FBGA package (484-FPBGA, 23 × 23) in a 484-BGA package case; surface-mount mounting suitable for modern PCB assembly.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C, suitable for typical commercial environments.
• Compliance  RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Programmable control and glue logic in consumer and commercial products where moderate temperature ranges and commercial grade components are used.
• I/O Expansion and Interface Bridging  High I/O count enables protocol bridging, bus interfacing, and aggregation of multiple peripheral connections.
• Prototyping and FPGA-Based Development  Used in development platforms and evaluation systems requiring substantial logic resources and on-chip memory for early-stage design validation.

Unique Advantages

• High Logic Capacity: 1,500,000 gates and 38,400 logic elements support complex logic functions without immediate need for external ASICs.
• Significant I/O Count: 223 user I/O pins provide flexibility for interfacing to multiple peripherals and mixed-signal front ends.
• Embedded Memory: Approximately 0.276 Mbits of on-chip RAM reduces dependence on external memory for small buffers and control structures.
• Compact Surface-Mount Package: 484-FPBGA (23×23) offers a high-density solution for space-constrained PCBs while maintaining robust connectivity.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant to align with commercial manufacturing and deployment requirements.

Why Choose M1AFS1500-1FG484?

The M1AFS1500-1FG484 positions itself as a commercially graded Fusion FPGA option for designers who need a substantial mix of logic resources, embedded memory, and high I/O in a compact surface-mount package. Its combination of gate count, logic elements, and I/O density makes it suitable for complex embedded logic functions, interface bridging, and development platform use.

Backed by Microchip Technology, this FPGA offers predictable electrical and thermal parameters—such as a defined core supply range and commercial operating temperature—that help streamline integration into production designs and scale across commercial product lines.

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