M1AFS1500-1FG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA |
|---|---|
| Quantity | 1,334 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 223 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-1FG484I – Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA
The M1AFS1500-1FG484I is a Fusion® field programmable gate array designed for industrial applications requiring substantial logic capacity and dense I/O. It integrates 1,500,000 gates with 38,400 logic elements and approximately 0.276 Mbits of embedded RAM to support custom digital functions and on-chip buffering.
Packaged in a 484-FPBGA (23×23) surface-mount package and specified for industrial operation from -40°C to 100°C, this device offers a combination of high I/O count (223 pins), defined core voltage range (1.425 V to 1.575 V), and RoHS compliance for regulated manufacturing environments.
Key Features
- Core Logic — 1,500,000 gates and 38,400 logic elements provide substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 0.276 Mbits of on-chip RAM for data buffering, state machines, and small lookup tables.
- I/O Capacity — 223 user I/O pins to support multiple peripherals, parallel interfaces, and board-level connectivity.
- Package — 484-FPBGA (23×23) surface-mount package delivering a high-pin-count, compact footprint for dense board layouts.
- Power — Core voltage supply range of 1.425 V to 1.575 V to match defined system power rails.
- Operating Range & Grade — Industrial grade device rated for operation from -40°C to 100°C for temperature-demanding environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial control — Industrial-grade temperature range and robust I/O make this FPGA suitable for factory automation and machine control functions.
- High-density I/O systems — 223 I/Os support complex interfacing tasks such as multi-channel acquisition, parallel buses, and mixed peripheral connectivity.
- Custom logic acceleration — Large gate count and 38,400 logic elements enable implementation of custom processors, accelerators, and protocol handling.
Unique Advantages
- High logic capacity: 1.5 million gates and 38,400 logic elements allow implementation of sizeable, integrated digital functions on a single device.
- On-chip memory for buffering: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small- to medium-sized data storage.
- Extensive I/O: 223 user I/Os enable flexible connectivity options without additional interface hardware.
- Compact, high-pin package: 484-FPBGA (23×23) provides a high pin count in a compact surface-mount form factor for space-constrained designs.
- Industrial temperature capability: Rated from -40°C to 100°C to support deployments in temperature-challenging environments.
- Regulatory compliance: RoHS compliance supports environmentally regulated manufacturing and end products.
Why Choose M1AFS1500-1FG484I?
The M1AFS1500-1FG484I positions itself as a high-capacity Fusion® FPGA option for designs that require a balance of large programmable logic, substantial I/O, and industrial temperature operation. Its combination of 1.5M gates, 38,400 logic elements, and 223 I/Os makes it suitable for engineers seeking to consolidate functions and reduce external component count.
For projects targeting industrial control, high-density interfacing, or custom hardware acceleration, this RoHS-compliant, surface-mount 484-BGA device offers a scalable, reliable platform that aligns with strict thermal and packaging requirements.
Request a quote or contact sales to discuss availability, pricing, and delivery for the M1AFS1500-1FG484I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D